PORTO @ Archivio Istituzionale della Ricerca

IANNUZZO, FRANCESCO
 Distribuzione geografica
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Continente #
AS - Asia 1.942
SA - Sud America 1.125
NA - Nord America 479
EU - Europa 229
AF - Africa 69
Continente sconosciuto - Info sul continente non disponibili 1
Totale 3.845
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Nazione #
BR - Brasile 899
SG - Singapore 675
VN - Vietnam 511
US - Stati Uniti d'America 423
CN - Cina 352
KR - Corea 215
AR - Argentina 101
IT - Italia 77
ID - Indonesia 70
EC - Ecuador 44
MX - Messico 34
BD - Bangladesh 30
GB - Regno Unito 29
ZA - Sudafrica 22
CL - Cile 19
FI - Finlandia 18
RU - Federazione Russa 18
CO - Colombia 17
PY - Paraguay 17
UA - Ucraina 17
EG - Egitto 16
MA - Marocco 16
HK - Hong Kong 14
IN - India 13
DE - Germania 12
IQ - Iraq 11
VE - Venezuela 11
UY - Uruguay 10
DK - Danimarca 9
JP - Giappone 9
CA - Canada 8
FR - Francia 7
PL - Polonia 7
DO - Repubblica Dominicana 5
HN - Honduras 5
NL - Olanda 5
PE - Perù 5
CH - Svizzera 4
ES - Italia 4
PK - Pakistan 4
SE - Svezia 4
TN - Tunisia 4
AZ - Azerbaigian 3
BG - Bulgaria 3
IE - Irlanda 3
JO - Giordania 3
KE - Kenya 3
KW - Kuwait 3
TR - Turchia 3
UZ - Uzbekistan 3
AE - Emirati Arabi Uniti 2
AL - Albania 2
AO - Angola 2
BH - Bahrain 2
BO - Bolivia 2
BW - Botswana 2
DZ - Algeria 2
IL - Israele 2
IR - Iran 2
KZ - Kazakistan 2
MN - Mongolia 2
NP - Nepal 2
PH - Filippine 2
RO - Romania 2
RS - Serbia 2
AM - Armenia 1
AT - Austria 1
BY - Bielorussia 1
CZ - Repubblica Ceca 1
EU - Europa 1
JM - Giamaica 1
KG - Kirghizistan 1
LT - Lituania 1
LV - Lettonia 1
MK - Macedonia 1
ML - Mali 1
NG - Nigeria 1
NI - Nicaragua 1
OM - Oman 1
QA - Qatar 1
SA - Arabia Saudita 1
SV - El Salvador 1
SY - Repubblica araba siriana 1
TH - Thailandia 1
TT - Trinidad e Tobago 1
Totale 3.845
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Città #
Singapore 364
Seoul 212
Ho Chi Minh City 205
Ashburn 148
Hanoi 98
Hefei 83
São Paulo 76
Los Angeles 56
Beijing 50
Buffalo 40
Haiphong 29
Dallas 27
Rio de Janeiro 23
Turin 20
Santa Clara 19
Guayaquil 18
Southend 18
Biên Hòa 17
Brasília 17
Thái Bình 17
Belo Horizonte 16
Lappeenranta 16
Salvador 16
Curitiba 15
Quito 15
Porto Alegre 14
Campinas 13
Da Nang 13
Hong Kong 13
New York 13
Guangzhou 11
Hortolândia 10
Osasco 10
Cairo 9
Johannesburg 9
Milan 9
Ninh Bình 9
Goiânia 8
Jakarta 8
Ribeirão Preto 8
Tokyo 8
Buenos Aires 7
Canoas 7
Hải Dương 7
Lấp Vò 7
Mexico City 7
Montevideo 7
Piracicaba 7
Shijiazhuang 7
Sorocaba 7
São Bernardo do Campo 7
Torino 7
Warsaw 7
Asunción 6
Baghdad 6
Betim 6
Brooklyn 6
Denver 6
Dhaka 6
Frankfurt am Main 6
Pelotas 6
Uberlândia 6
Anápolis 5
Barra Bonita 5
Barra Mansa 5
Bogotá 5
Bình Dương 5
Bắc Giang 5
Campos dos Goytacazes 5
Can Tho 5
Cape Town 5
Ha Long 5
Joinville 5
Kyiv 5
Natal 5
Orem 5
Recife 5
Resistencia 5
San Miguel de Tucumán 5
Santiago 5
Serra 5
São Gonçalo 5
São José 5
Tianjin 5
Aparecida de Goiânia 4
Bandung 4
Bauru 4
Boardman 4
Bình An 4
Carapicuíba 4
Caxias do Sul 4
Chapecó 4
Depok 4
Fazenda Rio Grande 4
Feira de Santana 4
Fortaleza 4
Guarulhos 4
Huế 4
Jundiaí 4
Lima 4
Totale 2.092
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Nome #
Role of parasitic capacitances in power MOSFET turn-on switching speed limits: a SiC case study 102
Reliability-Constrained Design of a High-Gain Power Optimizer based on a Real Mission Profile 85
Intelligent Condition Monitoring of Multiple Thermal Degradation of IGBT Modules Based on Case Temperature Matrix 84
Thermal Stress Emulation of Power Devices Subject to DFIG Wind Power Converter 74
A Distributed Turn-Off Delay Compensator Scheme for Voltage Balancing of Series-Connected IGBTs 71
Model-Based Thermal Stress and Lifetime Estimation of DFIG Wind Power Converter 70
Figures-of-Merit Study for Thermal Transient Measurement of SiC MOSFETs 70
Online Junction Temperature Extraction for Cascode GaN Devices Based on Turn-On Delay 70
Accuracy estimation of low-current voltage drop method for junction temperature monitoring under DC power cycling 69
Evaluation of the Thermal Resistance in GaN HEMTs Using Thermo-Sensitive Electrical Parameters 69
Large-Scale Adoption of Silicon Carbide in the Automotive Sector: What is Missing? 69
Proof-of-Concept for an On-Chip Kelvin-Emitter RTD Sensor for Junction Temperature Monitoring of IGBTs 68
Low Inductive Characterization of Fast-Switching SiC MOSFETs and Active Gate Driver Units 67
Factors Affecting Self-Sustained Switching Oscillations of Cascode GaN Devices and Mitigation Strategy during Parameter Design 66
Comparison of Junction Temperature Measurement Using the TSEP Method and Optical Fiber Method in IGBT Power Modules without Silicone Gel Removal 65
Analytical Modeling and Sensitivity Analysis on Plasma Extraction Transit Time (PETT) Oscillations in High-Voltage NPT p-i-n Diode 65
Design of a Non-destructive Device Test Platform Capable of Double-pulse Tests and Short-circuit Tests with Fast Overcurrent Protection for Wide Band-gap Devices 65
Application-Oriented Flexible Power Cycling Test System for Power Electronic Components 65
Short-Circuit Fault Adaptive Analysis and Protection for SiC MOSFETs 64
Junction temperature monitoring for cascode GaN devices using the Si MOSFET's body diode voltage drop 64
Lifetime prediction for press pack IGBT device by considering fretting wear failure 63
A Double-Sided Cooling Approach of Discrete SiC MOSFET Device Based on Press-Pack Package 63
In-Operation Junction Temperature Extraction for Cascode GaN Devices Based on Turn-Off Delay 63
A Novel Sensor-Reduction Condition Monitoring Approach for MMC Submodule IGBTs Based on Statistics of Inferred On-State Voltage 62
Comparative Analysis of Bond Wire Degradation in Power Modules during DC and AC Power Cycling 61
Investigation on the Short-circuit Withstand Capability of Press-pack IGBT modules with Optimized Package Structures 60
Short-Circuit Capability Optimization of Press-Pack IGBT by Improving Active Edge Heat Dissipation 60
Failure degradation similarities on power SiC MOSFET devices submitted to short-circuit stress and accelerated switching conditions 60
Multidimensional Mission-Profile-Based Lifetime Estimation Approach for IGBT Modules in MMC-HVdc Application Considering Bidirectional Power Transfer 59
Mission-profile-based stress analysis of bond-wires in SiC power modules 59
Investigating the solder mask defects impact on leakage current on PCB under condensing humidity conditions 57
Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors 56
Influence of Temperature on Bond Wire Fatigue of Gate Loops in IGBT Modules under Sinusoidal Vibration Stress 55
Temperature Monitoring of Multi-Chip SiC MOSFET Modules: On-Chip RTDs vs. VSD(T) 54
A time-resolved IBICC experiment using the IEEM of the SIRAD facility 53
Investigation on Saturation Voltage Increment of Multichip Press-Pack IGBTs Under Power Cycling Tests 53
Comparative Analysis of Power Semiconductor Thermal Stress in DC and AC Power Cycling 53
Optimization of a Bidirectional Boost Converter for Nanogrid Applications 53
A Fully Coupled Model of Multi-Chip Press-Pack IGBT for Thermo-Mechanical Stress Distribution Prediction 52
Reliability of WBG, results of a Pre-Scoping Study 50
Power converters for future LHC experiments 50
Ferrite Beads Design to Improve Turn-off Characteristics of Cascode GaN HEMTs: An Optimum Design Method 49
Thermal Mapping of Power Modules Using Optical Fibers during AC Power Cycling Tests 49
Improved Drain-source Voltage Detection Method for Short-circuit Protection of SiC MOSFET 48
Behavior of power MOSFETs during heavy ions irradiation performed after γ-rays exposure 47
IGBT RBSOA non-destructive testing methods: Analysis and discussion 47
A 3-D-Lumped Thermal Network Model for Long-Term Load Profiles Analysis in High-Power IGBT Modules 46
Operation of SiC normally-off JFET at the edges of its safe operating area 45
Impact of Solder Degradation on VCE of IGBT Module: Experiments and Modeling 45
Application-Oriented Reliability Testing of Power Electronic Components and Converters 45
Experimental study of Single Event Effects induced by heavy ion irradiation in enhancement mode GaN power HEMT 45
Three-Dimensional Safe Operating Area based Short-Circuit Failure Modes Investigation and Classification for High-Power IGBT Modules 44
Effects of On-State Snap-back Characteristics on the Current Sharing of Parallel RC-IGBTs 44
Online monitoring and correction method of threshold voltage in SiC MOSFET power cycling test 43
Measuring Temperature Swing with Optical Fibers during Power Cycling of Power Components 43
Reliability oriented design of power supplies for high energy physics applications 43
Single Event Effects in Power MOSFETs during Heavy Ion Irradiations Performed after Gamma Ray Degradation 43
Unclamped repetitive stress on 1200 V normally-off SiC JFETs 43
Analysis of Heavy Ion Irradiation Induced Thermal Damage in SiC Schottky Diodes 42
Instabilities in Silicon Power Devices: A Review of Failure Mechanisms in Modern Power Devices 42
Thermal damage in SiC Schottky diodes induced by SE heavy ions 42
Design for Reliability of SiC-MOSFET-Based 1500-V PV Inverters With Variable Gate Resistance 42
A survey of SiC power MOSFETs short-circuit robustness and failure mode analysis 41
On-line Junction Temperature and Current Synchronous Extraction for SiC MOSFETs With Electroluminescence Effect 41
Developments on DC/DC converters for the LHC experiment upgrades 41
Mechanoluminescence of nylon under high velocity impact 41
Power supply distribution system for calorimeters at the LHC beyond the nominal luminosity 39
Die degradation effect on aging rate in accelerated cycling tests of SiC power MOSFET modules 39
Robustness of MW-Level IGBT modules against gate oscillations under short circuit events 39
Analytical and Experimental Investigation on A Dynamic Thermo-Sensitive Electrical Parameter With Maximum $dI_C/dt$ During Turn-off for High Power Trench Gate/Field-Stop IGBT Modules 38
Advanced power cycler with intelligent monitoring strategy of IGBT module under test 38
Self-Sustained Turn-OFF Oscillation of Cascode GaN HEMTs: Occurrence Mechanism, Instability Analysis, and Oscillation Suppression 37
Simultaneous On-State Voltage and Bond-Wire Resistance Monitoring of Silicon Carbide MOSFETs 37
Aging Investigation of the Latest Standard Dual Power Modules Using Improved Interconnect Technologies by Power Cycling Test 37
Mission profile simplification method for reliability analysis of PV converters 35
Intrusiveness of Power Device Condition Monitoring Methods: Introducing Figures of Merit for Condition Monitoring 34
Prediction of the electrochemical migration induced failure on power PCBs under humidity condition A case study 27
High voltage, high performance switch using series connected IGBTs 9
null 7
Totale 4.135
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Categoria #
all - tutte 10.053
article - articoli 7.294
book - libri 0
conference - conferenze 2.759
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 20.106
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/202110 0 0 0 0 0 0 0 0 2 7 0 1
2021/202212 0 1 1 0 1 1 0 0 0 1 4 3
2022/202312 2 2 0 0 0 5 1 0 1 0 1 0
2023/20243 0 0 0 0 0 0 0 1 0 0 1 1
2024/2025551 0 6 0 1 0 0 0 9 3 18 105 409
2025/20263.508 312 426 868 1.439 274 189 0 0 0 0 0 0
Totale 4.135