Thermal Stress Emulation of Power Devices Subject to DFIG Wind Power Converter

The turbine system equipped with doubly-fed induction generation (DFIG) is widely used in wind power generation. Due to the increasing focus on its prolonged lifespan, it is particularly important to ensure the accurate thermal stress estimation and system reliability in the industrial field. This paper mainly focuses on the thermal stress and lifetime of power semiconductor devices used in DFIG back-to-back converters and its mission profile emulator H-bridge converter. By setting different loading profiles, the power consumption, as well as the junction temperature of the devices in the DFIG power converter is compared with the H-bridge emulator. Through lifetime model of the power device, the lifespan can be calculated according to the annual wind profile. PLECS simulation is applied to verify the comparison between the DFIG power converter and H-bridge converter.