The goal of this paper is to demonstrate a case study on prediction of the electrochemical migration (ECM) induced failures which occur on the printed circuit boards (PCBs). At first, a brief introduction on a gate driver PCB utilized in this study is provided. Under condensing conditions, the electrochemical reactions which occur on a PCB board contaminated by weak organic acids (WOAs) are investigated. Based on COMSOL, an approach is thereby proposed to simulate the electrochemical reactions. To calibrate the parameters utilized in the simulation, the leakage current (LC) on the surface insulation resistance (SIR) is measured. A parameter optimization procedure is thereby performed to make sure the simulated LC matches the measured data. To validate the proposed method, the humidity test is performed on the gate driver PCB. The failure observed in the test is compared with the simulated LC density, which is used as an indicator for the formation of ECM. Finally, the simulation is performed when the PCB operates under real operation conditions. The simulation identifies the possible ECM path which can occur on the PCB.

Prediction of the electrochemical migration induced failure on power PCBs under humidity condition A case study / Xue, Peng; (Amir Sajjad), Bahman; Iannuzzo, Francesco; (Helene Conseil), Gudla; (Anish Rao), Lakkaraju; Ambat, Rajan. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 139:(2022). [10.1016/j.microrel.2022.114796]

Prediction of the electrochemical migration induced failure on power PCBs under humidity condition A case study

Francesco Iannuzzo;
2022

Abstract

The goal of this paper is to demonstrate a case study on prediction of the electrochemical migration (ECM) induced failures which occur on the printed circuit boards (PCBs). At first, a brief introduction on a gate driver PCB utilized in this study is provided. Under condensing conditions, the electrochemical reactions which occur on a PCB board contaminated by weak organic acids (WOAs) are investigated. Based on COMSOL, an approach is thereby proposed to simulate the electrochemical reactions. To calibrate the parameters utilized in the simulation, the leakage current (LC) on the surface insulation resistance (SIR) is measured. A parameter optimization procedure is thereby performed to make sure the simulated LC matches the measured data. To validate the proposed method, the humidity test is performed on the gate driver PCB. The failure observed in the test is compared with the simulated LC density, which is used as an indicator for the formation of ECM. Finally, the simulation is performed when the PCB operates under real operation conditions. The simulation identifies the possible ECM path which can occur on the PCB.
File in questo prodotto:
File Dimensione Formato  
1-s2.0-S0026271422003201-main.pdf

accesso riservato

Tipologia: 2a Post-print versione editoriale / Version of Record
Licenza: Non Pubblico - Accesso privato/ristretto
Dimensione 4.22 MB
Formato Adobe PDF
4.22 MB Adobe PDF   Visualizza/Apri   Richiedi una copia
Prediction_of_the_electrochemical_migration_induced_failure_on_power_PCBs_under_humidity_condition_A_case_study-2-11.pdf

Open Access dal 08/10/2024

Tipologia: 2. Post-print / Author's Accepted Manuscript
Licenza: Creative commons
Dimensione 1.98 MB
Formato Adobe PDF
1.98 MB Adobe PDF Visualizza/Apri
Pubblicazioni consigliate

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11583/2997143