DU, BOYANG

DU, BOYANG  

Dipartimento di Automatica e Informatica  

Boyang, D.  

031122  

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Citazione Data di pubblicazione Autori File
An Automated Continuous Integration Multitest Platform for Automotive Systems / Du, Boyang; Azimi, Sarah; Moramarco, Annarita; Sabena, Davide; Parisi, Filippo; Sterpone, Luca. - In: IEEE SYSTEMS JOURNAL. - ISSN 1932-8184. - ELETTRONICO. - 16:2(2022), pp. 2495-2506. [10.1109/JSYST.2021.3069548] 1-gen-2022 Du, BoyangAzimi, SarahMoramarco, AnnaritaSabena, DavideSterpone, Luca + IEEESystem_2021.pdfAn_Automated_Continuous_Integration_Multitest_Platform_for_Automotive_Systems.pdf
A Neutron Generator Testing Platform for the Radiation Analysis of SRAM-based FPGAs / Bozzoli, L.; De Sio, C.; Du, B.; Sterpone, L.. - ELETTRONICO. - (2021), pp. 1-5. (Intervento presentato al convegno IEEE International Instrumentation and Measurement Technology Conference (I2MTC) tenutosi a Glasgow, United Kingdom nel 17-20 May 2021) [10.1109/I2MTC50364.2021.9459804]. 1-gen-2021 L. BozzoliC. De SioB. DuL. Sterpone 09459804.pdf
Reliability assessment on 16 nm ultrascale+ MPSoC using fault injection and fault tree analysis / Yang, Weitao; Du, Boyang; He, Chaohui; Sterpone, Luca. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 120:(2021), p. 114122. [10.1016/j.microrel.2021.114122] 1-gen-2021 Yang, WeitaoDu, BoyangSterpone, Luca + 1-s2.0-S0026271421000883-main.pdf
A 3D Simulation-based Approach to Analyze Heavy Ions-induced SET on Digital Circuits / Sterpone, L.; Luoni, F.; Azimi, S.; Du, B.. - In: IEEE TRANSACTIONS ON NUCLEAR SCIENCE. - ISSN 0018-9499. - (2020). [10.1109/TNS.2020.3006997] 1-gen-2020 L. SterponeS. AzimiB. Du + FINAL_VERSION.pdf09133159.pdf
Electron inducing soft errors in 28 nm system-on-Chip / Yang, W.; Li, Y.; Zhang, W.; Guo, Y.; Zhao, H.; Wei, J.; Li, Y.; He, C.; Chen, K.; Guo, G.; Du, B.; Sterpone, L.. - In: RADIATION EFFECTS AND DEFECTS IN SOLIDS. - ISSN 1042-0150. - 175:7-8(2020), pp. 745-754. [10.1080/10420150.2020.1759067] 1-gen-2020 Yang W.Du B.Sterpone L. + Electron inducing soft errors in 28 nm system on Chip.pdf
FlexGripPlus: An improved GPGPU model to support reliability analysis / Rodriguez Condia, Josie E.; Du, Boyang; Sonza Reorda, Matteo; Sterpone, Luca. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 109:(2020), pp. 1-14. [10.1016/j.microrel.2020.113660] 1-gen-2020 Rodriguez Condia, Josie E.Du, BoyangSonza Reorda, MatteoSterpone, Luca journal-version-V20.pdf1-s2.0-S0026271419307978-main.pdf
On the Mitigation of Single Event Transient in 3D LUT by In-Cell Layout Resizing / Azimi, Sarah; Du, Boyang; DE SIO, Corrado; Sterpone, Luca. - ELETTRONICO. - (2020), pp. 1-4. (Intervento presentato al convegno European Conference on Radiation and its Effects on Components and Systems (RADECS) tenutosi a Online event) [10.1109/RADECS50773.2020.9857719]. 1-gen-2020 Sarah AzimiBoyang DuCorrado De SioLuca Sterpone RADECS2020_CameraReady.pdfOn_the_Mitigation_of_Single_Event_Transient_in_3D_LUT_by_In-Cell_Layout_Resizing.pdf
Programmers manual FlexGripPlus SASS SM 1.0 / Rodriguez Condia, Josie Esteban; Du, Boyang; Roascio, Gianluca; Scie, Edouard; Guerrero Balaguera, Juan David. - ELETTRONICO. - (2020), pp. 1-67. [10.5281/ZENODO.3819312] 1-gen-2020 Rodriguez Condia, Josie EstebanDu, BoyangRoascio, GianlucaGuerrero Balaguera, Juan David + Programmers manual FlexGripPlus SASS.pdf
A new CAD tool for Single Event Transient Analysis and Mitigation on Flash-based FPGAs / Azimi, Sarah; Du, Boyang; Sterpone, Luca; Merodio Codinachs, David; Grimoldi, Raoul; Cattaneo, Luca. - In: INTEGRATION. - ISSN 0167-9260. - 67:(2019), pp. 73-81. [10.1016/j.vlsi.2019.02.001] 1-gen-2019 Sarah AzimiBoyang DuLuca Sterpone + 1-s2.0-S0167926018305753-main.pdf
A new Method for the Analysis of Radiation-induced Effects in 3D VLSI Face-to-Back LUTs / Sterpone, Luca; Bozzoli, Ludovica; DE SIO, Corrado; Du, Boyang; Azimi, Sarah. - ELETTRONICO. - (2019), pp. 205-208. (Intervento presentato al convegno IEEE International Conference on Synthesis, modeling, analysis and Simulation methods and applications to circuit design (SMACD)) [10.1109/SMACD.2019.8795296]. 1-gen-2019 Luca SterponeLudovica BozzoliCorrado De SioBoyang DuSarah Azimi SMACD2019.pdfA_new_Method_for_the_Analysis_of_Radiation-induced_Effects_in_3D_VLSI_Face-to-Back_LUTs.pdf
An extended model to support detailed GPGPU reliability analysis / Du, B.; RODRIGUEZ CONDIA, JOSIE ESTEBAN; Reorda, M. S.. - ELETTRONICO. - (2019), pp. 1-6. (Intervento presentato al convegno 14th IEEE International Conference on Design and Technology of Integrated Systems In Nanoscale Era, DTIS 2019 tenutosi a grc nel 2019) [10.1109/DTIS.2019.8735047]. 1-gen-2019 Du B.RODRIGUEZ CONDIA, JOSIE ESTEBANReorda M. S. camera ready version.pdf
An open source embedded-GPGPU model for the accurate analysis and mitigation of SEU effects / Du, B.; Rodriguez Condia, Josie E.; Sonza Reorda, M.; Sterpone, L.. - (2019), pp. 1-4. (Intervento presentato al convegno 2019 19th European Conference on Radiation and Its Effects on Components and Systems tenutosi a Montpellier (France) nel 16-20 September 2019) [10.1109/RADECS47380.2019.9745670]. 1-gen-2019 Du, B.Rodriguez Condia, Josie E.Sonza Reorda, M.Sterpone, L. An_open_source_embedded-GPGPU_model_for_the_accurate_analysis_and_mitigation_of_SEU_effects.pdf
Analysis of Radiation-induced SETs in 3D VLSI Face-to-Back LUTs / Sterpone, Luca; Bozzoli, Ludovica; DE SIO, Corrado; Du, Boyang; Azimi, Sarah. - (2019). (Intervento presentato al convegno 30th IEEE Radiation and its Effects on Components and Systems (RADECS 2019)). 1-gen-2019 Luca SterponeLudovica BozzoliCorrado De SioBoyang DuSarah Azimi -
Analyzing Radiation-induced Transient Errors on SRAM-based FPGAs by Propagation of Broadening Effect / DE SIO, Corrado; Azimi, Sarah; Sterpone, Luca; Du, Boyang. - In: IEEE ACCESS. - ISSN 2169-3536. - 7:(2019), pp. 140182-140189. [10.1109/ACCESS.2019.2915136] 1-gen-2019 Corrado De SioSarah AzimiLuca SterponeBoyang Du 08708270.pdf
On the evaluation of SEU effects in GPGPUs / Du, B.; Rodriguez Condia, Josie E.; Sonza Reorda, M.; Sterpone, L.. - ELETTRONICO. - (2019), pp. 1-6. (Intervento presentato al convegno 2019 IEEE Latin American Test Symposium (LATS) tenutosi a Santiago, Chile nel 11-13 March 2019) [10.1109/LATW.2019.8704643]. 1-gen-2019 Du, B.Rodriguez Condia, Josie E.Sonza Reorda, M.Sterpone, L. -
On the Reliability of Convolutional Neural Network Implementation on SRAM-based FPGA / Du, Boyang; Azimi, Sarah; DE SIO, Corrado; Bozzoli, Ludovica; Sterpone, Luca. - ELETTRONICO. - (2019). (Intervento presentato al convegno The 32nd IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology tenutosi a ESA-ESTEC & TU Delft, Netherlands nel 02/10/2019 - 04/10/2019) [10.1109/DFT.2019.8875362]. 1-gen-2019 Boyang DuSarah AzimiCorrado De SioLudovica BozzoliLuca Sterpone 08875362.pdf
Rad-Ray: A new Simulation Tool for the Analysis of Heavy Ions-induced SETs on ICs / Sterpone, Luca; Azimi, Sarah; Du, Boyang; Luoni, Francesca. - ELETTRONICO. - (2019). (Intervento presentato al convegno 30th IEEE Radiation and its Effects on Components and Systems (RADECS 2019)). 1-gen-2019 Luca SterponeSarah AzimiBoyang Du + -
Radiation-induced Single Event Transient effects during the reconfiguration process of SRAM-based FPGAs / De Sio, C.; Azimi, S.; Bozzoli, L.; Du, B.; Sterpone, L.. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - ELETTRONICO. - (2019). [10.1016/j.microrel.2019.06.034] 1-gen-2019 De Sio, C.Azimi, S.Bozzoli, L.Du, B.Sterpone, L. -
SETA-RAY: A New IDE tool for Predicting, Analyzing and Mitigating Radiation-induced Soft Errors on FPGAs / Sterpone, Luca; Du, Boyang; Azimi, Sarah. - ELETTRONICO. - (2019). (Intervento presentato al convegno IEEE design, automation and test in Europe - DATE 2019). 1-gen-2019 luca sterponeboyang duSarah azimi date_CameraReady.pdf
Ultra High Energy Heavy Ion Test Beam on Xilinx Kintex-7 SRAM-based FPGA / Du, Boyang; Sterpone, Luca; Azimi, Sarah; Merodio Codinachs, David; Ferlet-Cavrois, Véronique; Boatella Polo, Cesar; García Alía, Rubén; Kastriotou, Maria; Fernández-Martínez, Pablo. - In: IEEE TRANSACTIONS ON NUCLEAR SCIENCE. - ISSN 0018-9499. - ELETTRONICO. - 66:7(2019), pp. 1813-1819. [10.1109/TNS.2019.2915207] 1-gen-2019 Boyang DuLuca SterponeSarah Azimi + 08708253.pdf