DU, BOYANG
DU, BOYANG
Dipartimento di Automatica e Informatica
Boyang, D.
031122
An Automated Continuous Integration Multitest Platform for Automotive Systems
2022 Du, Boyang; Azimi, Sarah; Moramarco, Annarita; Sabena, Davide; Parisi, Filippo; Sterpone, Luca
A Neutron Generator Testing Platform for the Radiation Analysis of SRAM-based FPGAs
2021 Bozzoli, L.; De Sio, C.; Du, B.; Sterpone, L.
Reliability assessment on 16 nm ultrascale+ MPSoC using fault injection and fault tree analysis
2021 Yang, Weitao; Du, Boyang; He, Chaohui; Sterpone, Luca
A 3D Simulation-based Approach to Analyze Heavy Ions-induced SET on Digital Circuits
2020 Sterpone, L.; Luoni, F.; Azimi, S.; Du, B.
Electron inducing soft errors in 28 nm system-on-Chip
2020 Yang, W.; Li, Y.; Zhang, W.; Guo, Y.; Zhao, H.; Wei, J.; Li, Y.; He, C.; Chen, K.; Guo, G.; Du, B.; Sterpone, L.
FlexGripPlus: An improved GPGPU model to support reliability analysis
2020 Rodriguez Condia, Josie E.; Du, Boyang; Sonza Reorda, Matteo; Sterpone, Luca
On the Mitigation of Single Event Transient in 3D LUT by In-Cell Layout Resizing
2020 Azimi, Sarah; Du, Boyang; DE SIO, Corrado; Sterpone, Luca
Programmers manual FlexGripPlus SASS SM 1.0
2020 Rodriguez Condia, Josie Esteban; Du, Boyang; Roascio, Gianluca; Scie, Edouard; Guerrero Balaguera, Juan David
A new CAD tool for Single Event Transient Analysis and Mitigation on Flash-based FPGAs
2019 Azimi, Sarah; Du, Boyang; Sterpone, Luca; Merodio Codinachs, David; Grimoldi, Raoul; Cattaneo, Luca
A new Method for the Analysis of Radiation-induced Effects in 3D VLSI Face-to-Back LUTs
2019 Sterpone, Luca; Bozzoli, Ludovica; DE SIO, Corrado; Du, Boyang; Azimi, Sarah
An extended model to support detailed GPGPU reliability analysis
2019 Du, B.; RODRIGUEZ CONDIA, JOSIE ESTEBAN; Reorda, M. S.
An open source embedded-GPGPU model for the accurate analysis and mitigation of SEU effects
2019 Du, B.; Rodriguez Condia, Josie E.; Sonza Reorda, M.; Sterpone, L.
Analysis of Radiation-induced SETs in 3D VLSI Face-to-Back LUTs
2019 Sterpone, Luca; Bozzoli, Ludovica; DE SIO, Corrado; Du, Boyang; Azimi, Sarah
Analyzing Radiation-induced Transient Errors on SRAM-based FPGAs by Propagation of Broadening Effect
2019 DE SIO, Corrado; Azimi, Sarah; Sterpone, Luca; Du, Boyang
On the evaluation of SEU effects in GPGPUs
2019 Du, B.; Rodriguez Condia, Josie E.; Sonza Reorda, M.; Sterpone, L.
On the Reliability of Convolutional Neural Network Implementation on SRAM-based FPGA
2019 Du, Boyang; Azimi, Sarah; DE SIO, Corrado; Bozzoli, Ludovica; Sterpone, Luca
Rad-Ray: A new Simulation Tool for the Analysis of Heavy Ions-induced SETs on ICs
2019 Sterpone, Luca; Azimi, Sarah; Du, Boyang; Luoni, Francesca
Radiation-induced Single Event Transient effects during the reconfiguration process of SRAM-based FPGAs
2019 De Sio, C.; Azimi, S.; Bozzoli, L.; Du, B.; Sterpone, L.
SETA-RAY: A New IDE tool for Predicting, Analyzing and Mitigating Radiation-induced Soft Errors on FPGAs
2019 Sterpone, Luca; Du, Boyang; Azimi, Sarah
Ultra High Energy Heavy Ion Test Beam on Xilinx Kintex-7 SRAM-based FPGA
2019 Du, Boyang; Sterpone, Luca; Azimi, Sarah; Merodio Codinachs, David; Ferlet-Cavrois, Véronique; Boatella Polo, Cesar; García Alía, Rubén; Kastriotou, Maria; Fernández-Martínez, Pablo
Citazione | Data di pubblicazione | Autori | File |
---|---|---|---|
An Automated Continuous Integration Multitest Platform for Automotive Systems / Du, Boyang; Azimi, Sarah; Moramarco, Annarita; Sabena, Davide; Parisi, Filippo; Sterpone, Luca. - In: IEEE SYSTEMS JOURNAL. - ISSN 1932-8184. - ELETTRONICO. - 16:2(2022), pp. 2495-2506. [10.1109/JSYST.2021.3069548] | 1-gen-2022 | Du, BoyangAzimi, SarahMoramarco, AnnaritaSabena, DavideSterpone, Luca + | IEEESystem_2021.pdf; An_Automated_Continuous_Integration_Multitest_Platform_for_Automotive_Systems.pdf |
A Neutron Generator Testing Platform for the Radiation Analysis of SRAM-based FPGAs / Bozzoli, L.; De Sio, C.; Du, B.; Sterpone, L.. - ELETTRONICO. - (2021), pp. 1-5. (Intervento presentato al convegno IEEE International Instrumentation and Measurement Technology Conference (I2MTC) tenutosi a Glasgow, United Kingdom nel 17-20 May 2021) [10.1109/I2MTC50364.2021.9459804]. | 1-gen-2021 | L. BozzoliC. De SioB. DuL. Sterpone | 09459804.pdf |
Reliability assessment on 16 nm ultrascale+ MPSoC using fault injection and fault tree analysis / Yang, Weitao; Du, Boyang; He, Chaohui; Sterpone, Luca. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 120 (114122):(2021). [10.1016/j.microrel.2021.114122] | 1-gen-2021 | Yang, WeitaoDu, BoyangSterpone, Luca + | 1-s2.0-S0026271421000883-main.pdf |
A 3D Simulation-based Approach to Analyze Heavy Ions-induced SET on Digital Circuits / Sterpone, L.; Luoni, F.; Azimi, S.; Du, B.. - In: IEEE TRANSACTIONS ON NUCLEAR SCIENCE. - ISSN 0018-9499. - (2020). [10.1109/TNS.2020.3006997] | 1-gen-2020 | L. SterponeS. AzimiB. Du + | FINAL_VERSION.pdf; 09133159.pdf |
Electron inducing soft errors in 28 nm system-on-Chip / Yang, W.; Li, Y.; Zhang, W.; Guo, Y.; Zhao, H.; Wei, J.; Li, Y.; He, C.; Chen, K.; Guo, G.; Du, B.; Sterpone, L.. - In: RADIATION EFFECTS AND DEFECTS IN SOLIDS. - ISSN 1042-0150. - 175:7-8(2020), pp. 745-754. [10.1080/10420150.2020.1759067] | 1-gen-2020 | Yang W.Du B.Sterpone L. + | Electron inducing soft errors in 28 nm system on Chip.pdf |
FlexGripPlus: An improved GPGPU model to support reliability analysis / Rodriguez Condia, Josie E.; Du, Boyang; Sonza Reorda, Matteo; Sterpone, Luca. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - 109:(2020), pp. 1-14. [10.1016/j.microrel.2020.113660] | 1-gen-2020 | Rodriguez Condia, Josie E.Du, BoyangSonza Reorda, MatteoSterpone, Luca | journal-version-V20.pdf; 1-s2.0-S0026271419307978-main.pdf |
On the Mitigation of Single Event Transient in 3D LUT by In-Cell Layout Resizing / Azimi, Sarah; Du, Boyang; DE SIO, Corrado; Sterpone, Luca. - ELETTRONICO. - (2020), pp. 1-4. (Intervento presentato al convegno European Conference on Radiation and its Effects on Components and Systems (RADECS) tenutosi a Online event) [10.1109/RADECS50773.2020.9857719]. | 1-gen-2020 | Sarah AzimiBoyang DuCorrado De SioLuca Sterpone | RADECS2020_CameraReady.pdf; On_the_Mitigation_of_Single_Event_Transient_in_3D_LUT_by_In-Cell_Layout_Resizing.pdf |
Programmers manual FlexGripPlus SASS SM 1.0 / Rodriguez Condia, Josie Esteban; Du, Boyang; Roascio, Gianluca; Scie, Edouard; Guerrero Balaguera, Juan David. - ELETTRONICO. - (2020), pp. 1-67. [10.5281/ZENODO.3819312] | 1-gen-2020 | Rodriguez Condia, Josie EstebanDu, BoyangRoascio, GianlucaGuerrero Balaguera, Juan David + | Programmers manual FlexGripPlus SASS.pdf |
A new CAD tool for Single Event Transient Analysis and Mitigation on Flash-based FPGAs / Azimi, Sarah; Du, Boyang; Sterpone, Luca; Merodio Codinachs, David; Grimoldi, Raoul; Cattaneo, Luca. - In: INTEGRATION. - ISSN 0167-9260. - 67:(2019), pp. 73-81. [10.1016/j.vlsi.2019.02.001] | 1-gen-2019 | Sarah AzimiBoyang DuLuca Sterpone + | 1-s2.0-S0167926018305753-main.pdf |
A new Method for the Analysis of Radiation-induced Effects in 3D VLSI Face-to-Back LUTs / Sterpone, Luca; Bozzoli, Ludovica; DE SIO, Corrado; Du, Boyang; Azimi, Sarah. - ELETTRONICO. - (2019), pp. 205-208. (Intervento presentato al convegno IEEE International Conference on Synthesis, modeling, analysis and Simulation methods and applications to circuit design (SMACD)) [10.1109/SMACD.2019.8795296]. | 1-gen-2019 | Luca SterponeLudovica BozzoliCorrado De SioBoyang DuSarah Azimi | SMACD2019.pdf; A_new_Method_for_the_Analysis_of_Radiation-induced_Effects_in_3D_VLSI_Face-to-Back_LUTs.pdf |
An extended model to support detailed GPGPU reliability analysis / Du, B.; RODRIGUEZ CONDIA, JOSIE ESTEBAN; Reorda, M. S.. - ELETTRONICO. - (2019), pp. 1-6. (Intervento presentato al convegno 14th IEEE International Conference on Design and Technology of Integrated Systems In Nanoscale Era, DTIS 2019 tenutosi a grc nel 2019) [10.1109/DTIS.2019.8735047]. | 1-gen-2019 | Du B.RODRIGUEZ CONDIA, JOSIE ESTEBANReorda M. S. | camera ready version.pdf |
An open source embedded-GPGPU model for the accurate analysis and mitigation of SEU effects / Du, B.; Rodriguez Condia, Josie E.; Sonza Reorda, M.; Sterpone, L.. - (2019), pp. 1-4. (Intervento presentato al convegno 2019 19th European Conference on Radiation and Its Effects on Components and Systems tenutosi a Montpellier (France) nel 16-20 September 2019) [10.1109/RADECS47380.2019.9745670]. | 1-gen-2019 | Du, B.Rodriguez Condia, Josie E.Sonza Reorda, M.Sterpone, L. | An_open_source_embedded-GPGPU_model_for_the_accurate_analysis_and_mitigation_of_SEU_effects.pdf |
Analysis of Radiation-induced SETs in 3D VLSI Face-to-Back LUTs / Sterpone, Luca; Bozzoli, Ludovica; DE SIO, Corrado; Du, Boyang; Azimi, Sarah. - (2019). (Intervento presentato al convegno 30th IEEE Radiation and its Effects on Components and Systems (RADECS 2019)). | 1-gen-2019 | Luca SterponeLudovica BozzoliCorrado De SioBoyang DuSarah Azimi | - |
Analyzing Radiation-induced Transient Errors on SRAM-based FPGAs by Propagation of Broadening Effect / DE SIO, Corrado; Azimi, Sarah; Sterpone, Luca; Du, Boyang. - In: IEEE ACCESS. - ISSN 2169-3536. - 7:(2019), pp. 140182-140189. [10.1109/ACCESS.2019.2915136] | 1-gen-2019 | Corrado De SioSarah AzimiLuca SterponeBoyang Du | 08708270.pdf |
On the evaluation of SEU effects in GPGPUs / Du, B.; Rodriguez Condia, Josie E.; Sonza Reorda, M.; Sterpone, L.. - ELETTRONICO. - (2019), pp. 1-6. (Intervento presentato al convegno 2019 IEEE Latin American Test Symposium (LATS) tenutosi a Santiago, Chile nel 11-13 March 2019) [10.1109/LATW.2019.8704643]. | 1-gen-2019 | Du, B.Rodriguez Condia, Josie E.Sonza Reorda, M.Sterpone, L. | - |
On the Reliability of Convolutional Neural Network Implementation on SRAM-based FPGA / Du, Boyang; Azimi, Sarah; DE SIO, Corrado; Bozzoli, Ludovica; Sterpone, Luca. - ELETTRONICO. - (2019). (Intervento presentato al convegno The 32nd IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology tenutosi a ESA-ESTEC & TU Delft, Netherlands nel 02/10/2019 - 04/10/2019) [10.1109/DFT.2019.8875362]. | 1-gen-2019 | Boyang DuSarah AzimiCorrado De SioLudovica BozzoliLuca Sterpone | 08875362.pdf |
Rad-Ray: A new Simulation Tool for the Analysis of Heavy Ions-induced SETs on ICs / Sterpone, Luca; Azimi, Sarah; Du, Boyang; Luoni, Francesca. - ELETTRONICO. - (2019). (Intervento presentato al convegno 30th IEEE Radiation and its Effects on Components and Systems (RADECS 2019)). | 1-gen-2019 | Luca SterponeSarah AzimiBoyang Du + | - |
Radiation-induced Single Event Transient effects during the reconfiguration process of SRAM-based FPGAs / De Sio, C.; Azimi, S.; Bozzoli, L.; Du, B.; Sterpone, L.. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - ELETTRONICO. - (2019). [10.1016/j.microrel.2019.06.034] | 1-gen-2019 | De Sio, C.Azimi, S.Bozzoli, L.Du, B.Sterpone, L. | - |
SETA-RAY: A New IDE tool for Predicting, Analyzing and Mitigating Radiation-induced Soft Errors on FPGAs / Sterpone, Luca; Du, Boyang; Azimi, Sarah. - ELETTRONICO. - (2019). (Intervento presentato al convegno IEEE design, automation and test in Europe - DATE 2019). | 1-gen-2019 | luca sterponeboyang duSarah azimi | date_CameraReady.pdf |
Ultra High Energy Heavy Ion Test Beam on Xilinx Kintex-7 SRAM-based FPGA / Du, Boyang; Sterpone, Luca; Azimi, Sarah; Merodio Codinachs, David; Ferlet-Cavrois, Véronique; Boatella Polo, Cesar; García Alía, Rubén; Kastriotou, Maria; Fernández-Martínez, Pablo. - In: IEEE TRANSACTIONS ON NUCLEAR SCIENCE. - ISSN 0018-9499. - ELETTRONICO. - 66:7(2019), pp. 1813-1819. [10.1109/TNS.2019.2915207] | 1-gen-2019 | Boyang DuLuca SterponeSarah Azimi + | 08708253.pdf |