MAIO, IVANO ADOLFO
 Distribuzione geografica
Continente #
NA - Nord America 17.551
EU - Europa 12.785
AS - Asia 3.969
AF - Africa 77
SA - Sud America 31
OC - Oceania 4
Continente sconosciuto - Info sul continente non disponibili 3
Totale 34.420
Nazione #
US - Stati Uniti d'America 17.502
FR - Francia 3.482
CN - Cina 2.802
GB - Regno Unito 2.561
DE - Germania 2.102
IT - Italia 1.647
UA - Ucraina 928
NL - Olanda 435
SE - Svezia 373
TR - Turchia 337
IE - Irlanda 306
CH - Svizzera 225
RU - Federazione Russa 222
SG - Singapore 213
FI - Finlandia 168
IN - India 149
KR - Corea 147
JO - Giordania 107
JP - Giappone 63
VN - Vietnam 58
ZA - Sudafrica 56
AT - Austria 48
CA - Canada 46
BE - Belgio 41
RO - Romania 34
AP - ???statistics.table.value.countryCode.AP??? 31
EU - Europa 26
AE - Emirati Arabi Uniti 23
SI - Slovenia 23
GR - Grecia 21
CL - Cile 19
TW - Taiwan 16
ES - Italia 14
IR - Iran 14
IL - Israele 12
PT - Portogallo 12
NG - Nigeria 11
BR - Brasile 9
HK - Hong Kong 9
LV - Lettonia 8
PL - Polonia 8
HU - Ungheria 7
ID - Indonesia 7
MY - Malesia 7
PK - Pakistan 6
BG - Bulgaria 5
BY - Bielorussia 5
EE - Estonia 5
SA - Arabia Saudita 5
TH - Thailandia 5
NO - Norvegia 4
TN - Tunisia 4
AU - Australia 3
CZ - Repubblica Ceca 3
EG - Egitto 3
LU - Lussemburgo 3
MD - Moldavia 3
MK - Macedonia 3
PH - Filippine 3
AM - Armenia 2
AZ - Azerbaigian 2
DK - Danimarca 2
HR - Croazia 2
SC - Seychelles 2
AL - Albania 1
BD - Bangladesh 1
BO - Bolivia 1
CO - Colombia 1
CR - Costa Rica 1
DO - Repubblica Dominicana 1
DZ - Algeria 1
EC - Ecuador 1
GE - Georgia 1
IQ - Iraq 1
KG - Kirghizistan 1
KZ - Kazakistan 1
LT - Lituania 1
MM - Myanmar 1
MX - Messico 1
NZ - Nuova Zelanda 1
RS - Serbia 1
SK - Slovacchia (Repubblica Slovacca) 1
SY - Repubblica araba siriana 1
TJ - Tagikistan 1
UZ - Uzbekistan 1
Totale 34.420
Città #
Ashburn 4.707
Beijing 2.261
Southend 2.222
Seattle 2.031
Fairfield 1.680
Woodbridge 762
Cambridge 594
Houston 594
Wilmington 521
Buffalo 505
Des Moines 505
Jacksonville 489
Princeton 471
Ann Arbor 426
Chandler 407
Frankfurt 317
San Ramon 317
Dublin 296
Berlin 275
Izmir 275
San Jose 242
San Francisco 223
Bern 207
Bologna 196
San Donato Milanese 174
Turin 170
Boardman 165
Chicago 163
Helsinki 158
Hangzhou 141
Pennsylvania Furnace 139
Overberg 137
Zaporozhye 135
Singapore 122
Herkenbosch 121
Baltimore 117
Torino 117
Shanghai 112
Monopoli 109
Milan 108
Zhengzhou 104
Chennai 103
Padua 92
Las Vegas 84
Norwalk 83
Mountain View 82
Amsterdam 79
San Diego 79
Saint Petersburg 77
Fremont 76
Redwood City 76
Phoenix 66
Muizenberg 53
Dearborn 46
University Park 46
Malatya 45
Dong Ket 41
Piscataway 41
Rome 41
Council Bluffs 40
Vienna 40
Seoul 37
Brussels 36
Clearwater 33
Indiana 32
Melun 31
Fujian 30
Riva 28
Bangalore 27
Henderson 27
Toronto 26
Seongnam 25
Atlanta 23
Fort Lauderdale 23
Ljubljana 21
London 21
New York 21
Zhitomir 21
Guangzhou 20
Shenzhen 20
Wuhan 20
Andover 19
Austin 19
Frankfurt Am Main 19
Los Angeles 17
Nanjing 17
Dallas 16
Moscow 16
Paris 16
Washington 16
Osaka 15
Hanoi 14
Naples 14
Athens 12
Dubai 12
Redmond 12
Easton 11
Verona 11
Levallois-perret 10
Manchester 10
Totale 24.903
Nome #
Behavioral modeling of IC core power-delivery networks from measured data 559
Estimation of the Permittivity of Dielectrics from the Scattering Responses of TEM Waveguides 545
Parametric Macromodels of Digital I/O Ports 406
Analysis of crosstalk and field coupling to lossy MTL's in a SPICE environment 402
On-the-fly Estimation of IC Macromodels 399
Augmented Models of High-Frequency Transformers for SMPS 398
Characterization and modeling of the power delivery networks of memory chips 392
Behavioral Models of I/O Ports from Measured Transient Waveforms 392
Behavioural Macromodels of Digital IC Receivers for Analogue-Mixed Signal Simulations 387
Single and Multi-Piece Behavioral Models of IC Output Buffers 383
Linear and Nonlinear Macromodels for System-Level Signal Integrity and EMC Assessment 383
Behavioral Modeling of IC Ports Including Temperature Effects 382
Single-Piece State-Space Behavioral Models for IC Output Buffers 379
Behavioral Models of Input/Output Buffers Including Core Noise Coupling 375
Device Macromodel Impact on Data Link Performance Assessment 374
Combined FDTD/Macromodel simulation of interconnected digital devices 373
Modeling of IC power supply and I/O ports from measurements 373
Qualitative analysis of the dynamics of the time delayed Chua's circuit 371
Parametric Macromodels of Differential Drivers and Receivers 366
Locally-Stable Macromodels of Integrated Digital Devices for Multimedia Applications 363
Reliable Eye-Diagram Analysis of Data Links via Device Macromodels 363
Assessment of Equivalent Noise Source Approach for EMI Simulations of Boost Converter 360
The Role of Probe Attenuation in the Time-Domain Reflectometry Characterization of Dielectrics 359
Guaranteed Locally-Stable Macromodels of Digital Devices via Echo State Networks 358
Behavioral Models of IC Output Buffers from on-the-fly measurements 358
Efficient computation of transient responses of frequency-dependent nonlinearly loaded transmission lines 354
Circuit Extraction via Time-Domain Vector Fitting 351
A comparison of reduced-order techniques for complex interconnects modeling 349
Behavioral Modeling of Flash Memories 348
Transient field coupling and crosstalk in lossy lines with arbitrary loads 346
On the Modeling of Packages from their Time Responses 345
Lossy transmission line response via numerical Laplace transform inversion 345
Behavioral modeling of digital IC input and output ports 344
Behavioral Macromodels of Differential Drivers 343
Time-domain and frequency-domain macromodeling: application to package structures 343
NARX approach to black-box modeling of circuit elements 338
Behavioral models of digital IC ports from measured transient waveforms 337
Linear and Nonlinear Macromodels for Power/Signal Integrity 335
Composite local-linear state-space models for the behavioral modeling of digital devices 330
Macromodels of IC Buffers Allowing for Large Power Supply Fluctuations 327
Numerical modeling of digital devices impact on EMC/EMI 326
Parametric Macromodels of Drivers for SSN Simulations 326
Behavioral Macromodels of Differential Drivers with Pre-Emphasis 325
Parametric Macromodels of Differential Drivers with Pre-Emphasis 325
Time-domain Reflectometry (TDR) technique for the estimation of soil permittivity 321
Numerical Simulation of Aeronautic Cable Topology and Experimental Validation 319
Influence of the line characterization on the transient analysis of nonlinearly loaded lossy transmission lines 315
Scattering analysis of signal degradation and interferences on long and lossy interconnects 315
Recent Advances in reduced-order modeling of complex interconnects 312
Transient simulation of lossy multiconductor interconnects 307
On the Behavioral Modeling of Integrated Circuit Output Buffers 306
Macromodeling of Digital I/O Ports for System EMC Assessment 299
Differential-difference equations for the transient simulation of lossy MTLs 289
Macromodeling of IC output buffers from in-place measurements 289
Analysis and design criteria of three-section DBR tunable lasers 289
A Hybrid Technique for System-Level Signal Integrity and EMC Assessment 284
Behavioral Modeling of IC Output Buffers: a case study 280
Behavioral Modelling of Digital Devices Via Composite Local-Linear State-Space Relations 269
Transient Analysis of lossy transmission lines (TOPLine) 266
M[pi]log, Macromodeling via parametric identification of logic gates 245
Macromodeling of Differential Drivers 244
Accurate and Efficient Parametric Macromodeling of IC Drivers via Sigmoidal Basis Functions 241
Influence of laser fluctuations on soliton propagation in optical fibres 226
Black-Box Modeling of Digital Devices 226
Design of High Power Low Noise Polarization Insensitive Ridge Waveguide Laser Amplifiers 226
Efficient transient analysis of nonlinearly loaded low-loss multiconductor interconnects 224
TDR response properties and their use in the estimation of soil permittivity 221
Lossy interconnect modeling for transient simulations 220
Modeling of multiconductor buses and analysis of crosstalk, propagation delay and pulse distortion in high speed GaAs logic circuits 216
Macromodeling strategy for digital devices and interconnects 214
Experimental Characterization and Modeling of High-Frequency Transformers for SMPS 213
Identification of models for digital integrated circuit ports from measured transient waveforms 212
Analisi comportamentale full-wave di circuiti digitali interconnessi 210
A computer program for accurate time-domain analysis of 1D arrays of Chua's oscillators 209
Mode Competition and Switching in Three Section DBR Tunable Lasers 209
Full-Wave Modeling of Interconnected Digital Devices 205
Mpilog, Macromodeling via Parametric Identification of Logic Gates 202
Influence of the parasitics on the time delayed Chua's circuit 202
Complex Permittivity Determination from Measured Scattering Parameters of TEM Waveguides 200
Modeling of Interconnect Junctions from measured scattering responses 199
Modeling of the static and dynamic behavior of differential drivers 198
Estimation of broadband IC macromodels from external measurements 196
Behavioral modeling of digital devices via black-box identification 193
Soil permittivity estimation from TDR measurements: properties and guidelines 193
Fast Exact Inversion of the Generalized Zakharov–Shabat Problem for Rational Scattering Data: Application to the Synthesis of Optical Couplers 192
Caratterizzazione di dispositivi logici mediante espansione di funzioni radiali 190
Influence of device models on PCB radiation 190
Analog and Mixed-Signal Simulation of EMC at System Level 190
Frequency-domain circuit analysis 189
Simulation of multicarrier travelling-wave semiconductor laser amplifiers 189
Signal Integrity and Behavioral Models of Digital Devices 188
Complex Permittivity Determination from Measured Scattering Parameters of TEM Waveguides 187
Fast and accurate analysis of one-dimensional arrays of PWL cells 186
On-the-fly estimation of IC output port macromodel 184
High performance RBF models of digital drivers 182
A Systematic Procedure for the Macromodeling of Complex Interconnects and Packages 182
De-embedding of TEM waveguide responses from measured scattering parameters 182
Inclusione delle incertezze di fabbricazione nella predizione del comportamento statistico di sistemi di interconnessione 181
Foreward 176
Identification of electrical models (IdEM) 176
Totale 29.005
Categoria #
all - tutte 86.203
article - articoli 20.633
book - libri 0
conference - conferenze 62.300
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 3.270
Totale 172.406


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/20204.302 0 307 196 555 598 598 558 535 524 201 138 92
2020/20212.750 339 315 144 352 171 375 167 261 143 209 136 138
2021/20221.581 68 142 8 47 61 157 238 42 40 139 275 364
2022/20232.658 218 367 20 102 242 307 594 104 238 17 214 235
2023/2024827 31 209 38 25 74 46 10 45 42 48 81 178
2024/202576 69 7 0 0 0 0 0 0 0 0 0 0
Totale 34.794