Electronics employed in modern safety-critical systems require severe qualification during the manufacturing process and in the field, to prevent fault effects from manifesting themselves as critical failures during mission operations. Traditional fault models are not sufficient anymore to guarantee the required quality levels for chips utilized in mission-critical applications. The research community and industry have been investigating new test approaches such as device-aware test, cell-aware test, path-delay test, and even test methodologies based on the analysis of manufacturing data to move the scope from OPPM to OPPB. This special session presents four contributions, from academic researchers and industry professionals, to enable better chip quality. We present results on various activities towards this objective, including device-aware test, software-based self-test, and memory test.

Recent Trends and Perspectives on Defect-Oriented Testing / Bernardi, P.; Cantoro, R.; Coyette, A.; Dobbeleare, W.; Fieback, M.; Floridia, A.; Gielen, G.; Gomez, J.; Grosso, M.; Guerriero, A. M.; Guglielminetti, I.; Hamdioui, S.; Insinga, G.; Mautone, N.; Mirabella, N.; Sartoni, S.; Sonza Reorda, M.; Ullmann, R.; Vanhooren, R.; Xama, N.; Wu, L.. - (2022). (Intervento presentato al convegno The 28th IEEE International Symposium on On-Line Testing and Robust System Design (IOLTS) tenutosi a Torino (Italy) nel 12-14 September 2022) [10.1109/IOLTS56730.2022.9897647].

Recent Trends and Perspectives on Defect-Oriented Testing

P. Bernardi;R. Cantoro;A. Floridia;M. Grosso;S. Hamdioui;G. Insinga;N. Mirabella;S. Sartoni;M. Sonza Reorda;L. Wu
2022

Abstract

Electronics employed in modern safety-critical systems require severe qualification during the manufacturing process and in the field, to prevent fault effects from manifesting themselves as critical failures during mission operations. Traditional fault models are not sufficient anymore to guarantee the required quality levels for chips utilized in mission-critical applications. The research community and industry have been investigating new test approaches such as device-aware test, cell-aware test, path-delay test, and even test methodologies based on the analysis of manufacturing data to move the scope from OPPM to OPPB. This special session presents four contributions, from academic researchers and industry professionals, to enable better chip quality. We present results on various activities towards this objective, including device-aware test, software-based self-test, and memory test.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11583/2971520