Self-Test Libraries (STLs) developed for path-delay faults are crucial to ensure the reliability of modern digital integrated circuits, since they represent a widely adopted solution to detect in-field faults occurring during the operational phase, e.g., due to aging. However, physical parameters may shift over time, leading to changes in device behavior and potential failures with respect to end of manufacturing. This is especially crucial in safety-critical applications such as those adopted in automotive systems. The main objective of this paper is to assess the quality of STLs over time by monitoring how critical paths change due to aging effects and evaluating the fault coverage of STLs. An automatic framework is proposed to age an integrated circuit starting from a limited set of physical data related to the adopted technology. The insights gained from this approach will allow test engineers to harden STLs and ensure that strict reliability requirements are always met.

Evaluating the Impact of Aging on Path-Delay Self-Test Libraries / Cantoro, Riccardo; Sartoni, Sandro; Reorda, Matteo Sonza; Anghel, Lorena; Portolan, Michele. - (2023). (Intervento presentato al convegno IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (DFT) 2023 tenutosi a Juan-Les-Pins (FRA) nel 03-05 October 2023) [10.1109/dft59622.2023.10313531].

Evaluating the Impact of Aging on Path-Delay Self-Test Libraries

Cantoro, Riccardo;Sartoni, Sandro;Reorda, Matteo Sonza;Portolan, Michele
2023

Abstract

Self-Test Libraries (STLs) developed for path-delay faults are crucial to ensure the reliability of modern digital integrated circuits, since they represent a widely adopted solution to detect in-field faults occurring during the operational phase, e.g., due to aging. However, physical parameters may shift over time, leading to changes in device behavior and potential failures with respect to end of manufacturing. This is especially crucial in safety-critical applications such as those adopted in automotive systems. The main objective of this paper is to assess the quality of STLs over time by monitoring how critical paths change due to aging effects and evaluating the fault coverage of STLs. An automatic framework is proposed to age an integrated circuit starting from a limited set of physical data related to the adopted technology. The insights gained from this approach will allow test engineers to harden STLs and ensure that strict reliability requirements are always met.
2023
979-8-3503-1500-4
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11583/2992029