An Optimized Test During Burn-In for Automotive SoC

The cost of Burn-In is a major concern for the testing of Automotive Systems-on-Chip (SoCs). This paper proposes an optimized Test-During-Burn-In (TDBI) flow that takes advantage of the parallel execution of several types of stress procedures in which many components are carefully interleaved. The proposed methodology permits to significantly reduce the BI time and enables production monitoring by providing detailed test data-logging capabilities helping the debug of potential yield issues largely caused by the ageing of Burn-In tester consumable parts. The paper describes an experimental scenario about TDBI of an automotive SoC manufactured by STMicroelectronics.