Archivio Istituzionale della RicercaThermal phenomena occurring along test execution at the final stages of the manufacturing flow are considered as a significant issue for several reasons, including dramatic effects like circuit damage that is leading to yield loss. This paper tries to redeem those bad guys in order to exploit them to improve the test quality, reducing the overall test cost without affecting the yield.
Thermal issues in test: An overview of the significant aspects and industrial practice / Alt, J.; Bernardi, Paolo; Bosio, A.; Cantoro, Riccardo; Kerkhoff, H.; Leininger, A.; Molzer, W.; Motta, A.; Pacha, C.; Pagani, A.; Rohani, A.; Strasser, R.. - STAMPA. - 2016-:(2016), pp. 1-4. (Intervento presentato al convegno 34th IEEE VLSI Test Symposium, VTS 2016 tenutosi a Las Vegas (USA) nel 25-27 April 2016) [10.1109/VTS.2016.7477278].
Thermal issues in test: An overview of the significant aspects and industrial practice
BERNARDI, PAOLO;CANTORO, RICCARDO;
2016
Abstract
Thermal phenomena occurring along test execution at the final stages of the manufacturing flow are considered as a significant issue for several reasons, including dramatic effects like circuit damage that is leading to yield loss. This paper tries to redeem those bad guys in order to exploit them to improve the test quality, reducing the overall test cost without affecting the yield.
Pubblicazioni consigliate
I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
https://hdl.handle.net/11583/2644331
Attenzione
Attenzione! I dati visualizzati non sono stati sottoposti a validazione da parte dell'ateneo