Archivio Istituzionale della RicercaSystem in package integrates multiple dies in a common package. Therefore, testing SiP technology is different from system on chip, which integrates multiple vendor parts. This article provides test strategies for known good die and known good substrate in the SiP. Case studies prove feasibility using the IEEE 1500 test structure.
System-in-package testing: problems and solutions / Appello, D; Bernardi, Paolo; Grosso, Michelangelo; SONZA REORDA, Matteo. - In: IEEE DESIGN & TEST OF COMPUTERS. - ISSN 0740-7475. - Volume: 23 , Issue: 3:(2006), pp. 203-211. [10.1109/MDT.2006.79]
System-in-package testing: problems and solutions
BERNARDI, PAOLO;GROSSO, MICHELANGELO;SONZA REORDA, Matteo
2006
Abstract
System in package integrates multiple dies in a common package. Therefore, testing SiP technology is different from system on chip, which integrates multiple vendor parts. This article provides test strategies for known good die and known good substrate in the SiP. Case studies prove feasibility using the IEEE 1500 test structure.
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https://hdl.handle.net/11583/1499495
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