A methodology to simulate Package and PCB with a quasi-static solver is developed. The widespread cascade method, where Package and PCB are first simulated standalone to reduce the required computational effort and then recombined, is improved to consider electromagnetic interactions between the two systems. The proposed approach provides results very similar to that achieved with the full system simulation, but with a computational cost that is very similar to that of the standard cascade method.

Simulation Method for Quasi-Static Solver to Effectively Model Parasitic Components Between Package and PCB / Simone, Silvia; Pareschi, Fabio; Lena, Davide; Setti, Gianluca. - STAMPA. - (2024). (Intervento presentato al convegno 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS2024) tenutosi a Toronto (Can) nel 06-09 October 2024) [10.1109/epeps61853.2024.10754476].

Simulation Method for Quasi-Static Solver to Effectively Model Parasitic Components Between Package and PCB

Simone, Silvia;Pareschi, Fabio;Setti, Gianluca
2024

Abstract

A methodology to simulate Package and PCB with a quasi-static solver is developed. The widespread cascade method, where Package and PCB are first simulated standalone to reduce the required computational effort and then recombined, is improved to consider electromagnetic interactions between the two systems. The proposed approach provides results very similar to that achieved with the full system simulation, but with a computational cost that is very similar to that of the standard cascade method.
2024
979-8-3503-5123-1
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11583/2995725