Archivio Istituzionale della RicercaThe modified LB-PBF (laser beam powder bed fusion) process introduced and patented by the author allows to integrate discrete packaged sensors and/or customized electronics into the metal component during its additive manufacturing (AM) growth. This technology allows producing smart components suitable for networking, data sharing and IIoT (industrial interner of things) applications. The main advantages of sensors embedding in metal components are insulation from contaminations, protection against tampering, efficient transducer positioning, traceability of components, etc. This paper reports the design and fabrication of samples made with steel (17-4 PH), aluminum alloy (AlSi10Mg) and Inconel (In718) with integrated thermal sensors (k-type thermocouple and PT100 sensor) and USHX electronic connectors. The process is conducted with the EOS270 and SLM500 systems.
Thermal sensing of AM components through electronics embedding in LB-PBF process / DE PASQUALE, Giorgio. - ELETTRONICO. - (2022), pp. 105-106. (Intervento presentato al convegno ICoNSoM 2022 - International Conference of Nonlinear Solid Mechanics tenutosi a Alghero nel 13-16 June 2022).
Thermal sensing of AM components through electronics embedding in LB-PBF process
Giorgio De Pasquale
2022
Abstract
The modified LB-PBF (laser beam powder bed fusion) process introduced and patented by the author allows to integrate discrete packaged sensors and/or customized electronics into the metal component during its additive manufacturing (AM) growth. This technology allows producing smart components suitable for networking, data sharing and IIoT (industrial interner of things) applications. The main advantages of sensors embedding in metal components are insulation from contaminations, protection against tampering, efficient transducer positioning, traceability of components, etc. This paper reports the design and fabrication of samples made with steel (17-4 PH), aluminum alloy (AlSi10Mg) and Inconel (In718) with integrated thermal sensors (k-type thermocouple and PT100 sensor) and USHX electronic connectors. The process is conducted with the EOS270 and SLM500 systems.
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https://hdl.handle.net/11583/2969666