Advanced Method for 3D FIB Tomography AI Supported on SRAM I/O Circuit Block with Missing Data Bits Problems

Supported by new algorithms based on Artificial Intelligence (AI), FIB μ-tomography has recently been added to the arsenal of Physical Failure Analysis (PFA) methods. This paper shows the efficiency of these methods to solve difficult device development problems. We present 3D reconstruction of a failing I/O circuit block of an SRAM. The tomography unequivocally demonstrated that the problem was not attributable to process or line defects. It was only through the study of the 3D model that a solution to this difficult case could be achieved, prompting the developers to revise their silicon sizing parameter optimization for minimum size deviations.