Cu-Ni-Si alloys are advanced materials for electronic applications combining high mechanical strength and electrical conductivity through precipitation of fine Ni silicides. Increasing the Ni content—and, thus, the Ni:Si ratio—enhances the volume fraction of strengthening precipitates. However, the conventional fabrication route is time-consuming and costly, as the slow cooling rates lead to a coarse microstructure and pronounced segregation, limiting Ni and Si content to 5 wt.%. Rapid solidification techniques offer a promising alternative, since the higher cooling rates refine the microstructure while suppressing the elemental segregation. This study presents a novel powder-based approach to overcome the compositional limitations of Cu-Ni-Si alloys, providing a pathway for faster alloy screening. Two gas-atomized powders with different Ni contents—CuNi3Si1.5 and CuNi10Si1.5 (wt.%)—were engineered as feedstock for laser powder bed fusion, produced, and characterized to assess the effect of the Ni level on the microstructure and properties. Gas-atomization yielded spherical powders with a fine dendritic structure and limited segregation. Increased Ni content enhanced strengthening mechanisms and hardness, as well as improved optical response, suggesting the potential of high-Ni Cu-Ni-Si compositions for use in laser powder bed fusion.
Effect of High Ni Content in Gas-Atomized Cu-Ni-Si Powders for Laser Powder Bed Fusion / Trovato, Mirko; Arcieri, Nicolo; Manfredi, Diego; Gobber, Federico Simone; Bhatt, Bhaskaranand; Martucci, Alessandra; Biamino, Sara; Montanaro, Laura; Lombardi, Mariangela; Fino, Paolo. - In: MATERIALS. - ISSN 1996-1944. - 18:20(2025). [10.3390/ma18204772]
Effect of High Ni Content in Gas-Atomized Cu-Ni-Si Powders for Laser Powder Bed Fusion
Trovato, Mirko;Arcieri, Nicolo;Manfredi, Diego;Gobber, Federico Simone;Bhatt, Bhaskaranand;Martucci, Alessandra;Biamino, Sara;Montanaro, Laura;Lombardi, Mariangela;Fino, Paolo
2025
Abstract
Cu-Ni-Si alloys are advanced materials for electronic applications combining high mechanical strength and electrical conductivity through precipitation of fine Ni silicides. Increasing the Ni content—and, thus, the Ni:Si ratio—enhances the volume fraction of strengthening precipitates. However, the conventional fabrication route is time-consuming and costly, as the slow cooling rates lead to a coarse microstructure and pronounced segregation, limiting Ni and Si content to 5 wt.%. Rapid solidification techniques offer a promising alternative, since the higher cooling rates refine the microstructure while suppressing the elemental segregation. This study presents a novel powder-based approach to overcome the compositional limitations of Cu-Ni-Si alloys, providing a pathway for faster alloy screening. Two gas-atomized powders with different Ni contents—CuNi3Si1.5 and CuNi10Si1.5 (wt.%)—were engineered as feedstock for laser powder bed fusion, produced, and characterized to assess the effect of the Ni level on the microstructure and properties. Gas-atomization yielded spherical powders with a fine dendritic structure and limited segregation. Increased Ni content enhanced strengthening mechanisms and hardness, as well as improved optical response, suggesting the potential of high-Ni Cu-Ni-Si compositions for use in laser powder bed fusion.| File | Dimensione | Formato | |
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