This study presents a multi-physics modeling framework based on the Carrera Unified Formulation (CUF) within a virtual manufacturing environment to analyze the effects of embedded sensors in composite structures. The proposed layer-wise approach enables high-fidelity representation of the sensor-structure interface, accurately predicting interlaminar stress distributions and residual deformations around the sensor. By incorporating a multi-field electromechanical description, the model enables real-time monitoring of the curing process by tracking capacitance variations, thus providing a direct evaluation of the degree of cure. Furthermore, the framework predicts the development of residual stress fields induced by sensor integration, offering critical insights into local stress concentrations that could affect structural performance. The results highlight the importance of advanced modeling techniques for minimizing stress accumulation and optimizing the integration of sensors. Finally, the study demonstrates how virtual manufacturing environments can improve sensor placement strategies, enhancing the overall reliability and longevity of smart composite structures.

Advanced multi-field modeling for the virtual manufacturing of layered structures with embedded sensors / Zappino, E.; Petrolo, M.. - ELETTRONICO. - (2025). (Intervento presentato al convegno XI ECCOMAS Thematic Conference on Smart Structures and Materials SMART 2025 tenutosi a Linz, Austria nel 1-3 July, 2025).

Advanced multi-field modeling for the virtual manufacturing of layered structures with embedded sensors

E. Zappino;M. Petrolo
2025

Abstract

This study presents a multi-physics modeling framework based on the Carrera Unified Formulation (CUF) within a virtual manufacturing environment to analyze the effects of embedded sensors in composite structures. The proposed layer-wise approach enables high-fidelity representation of the sensor-structure interface, accurately predicting interlaminar stress distributions and residual deformations around the sensor. By incorporating a multi-field electromechanical description, the model enables real-time monitoring of the curing process by tracking capacitance variations, thus providing a direct evaluation of the degree of cure. Furthermore, the framework predicts the development of residual stress fields induced by sensor integration, offering critical insights into local stress concentrations that could affect structural performance. The results highlight the importance of advanced modeling techniques for minimizing stress accumulation and optimizing the integration of sensors. Finally, the study demonstrates how virtual manufacturing environments can improve sensor placement strategies, enhancing the overall reliability and longevity of smart composite structures.
File in questo prodotto:
Non ci sono file associati a questo prodotto.
Pubblicazioni consigliate

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11583/3003616
 Attenzione

Attenzione! I dati visualizzati non sono stati sottoposti a validazione da parte dell'ateneo