A Comprehensive Scan Test Cost Model to Optimize the Production of very large SoCs

This paper explores the trade-offs of reducing scan test patterns during Wafer Sort, accepting additional packaging costs, and screening more chips during Package Tests. Previous works proposed ways of selecting or reordering patterns to bring the most efficient to the left. Unlike such studies, this work quantifies the benefit of removing patterns directly from the tail of any pattern set. The paper elaborates on novel formulas to propose a comprehensive cost model that combines yield, Wafer Sort, packaging, and Package Test costs. The model evolves from known concepts by assuming that mass production defectivity is non-uniformly distributed over the die population and accounts for sacrificial lots to extract guiding information. It is shown that reducing patterns at Wafer Sort is beneficial under certain conditions of yield, fault coverage, and considering equipment and production costs. The model accurately estimates the number of patterns to remove for maximum gain in these cases. As a further byproduct, the paper shows that a significant cost advantage can be achieved if pattern generation is guided based on the basics of the non-uniform failure distribution. This approach is validated with an academic benchmark and by observing six months of production for a real-world microcontroller by STMicroelectronics.