This paper deals with a smart System in Package (SiP) synchronous MOSFET half-bridge with internal current and thermal sensing circuits devoted to low-voltage supplies for autonomous driving applications. This kind of advanced application requests that Buck, Boost, or Buck-Boost converters can supply and stabilize the voltage. Furthermore, the temperature and the load current must be continuously monitored and controlled to increase the system's reliability. The SiP half-bridge described is experimentally evaluated in a Buck converter operation. Finally, a Buck interleaved configuration to improve the output current ripple and increase the current fed is experimentally investigated. The experimental results investigation demonstrates the effectiveness of the proposed SiP integrated half-bridge solution for an enhanced and reliable low voltage power supply.
Advanced Low-Voltage System-in-Package Half-Bridge MOSFET with Added Protection Features / Musumeci, S.; Barba, V.; Scrimizzi, F.; Mistretta, C.. - ELETTRONICO. - (2022). (Intervento presentato al convegno 24th European Conference on Power Electronics and Applications, EPE 2022 ECCE Europe tenutosi a deu nel 2022).
Advanced Low-Voltage System-in-Package Half-Bridge MOSFET with Added Protection Features
Musumeci S.;Barba V.;
2022
Abstract
This paper deals with a smart System in Package (SiP) synchronous MOSFET half-bridge with internal current and thermal sensing circuits devoted to low-voltage supplies for autonomous driving applications. This kind of advanced application requests that Buck, Boost, or Buck-Boost converters can supply and stabilize the voltage. Furthermore, the temperature and the load current must be continuously monitored and controlled to increase the system's reliability. The SiP half-bridge described is experimentally evaluated in a Buck converter operation. Finally, a Buck interleaved configuration to improve the output current ripple and increase the current fed is experimentally investigated. The experimental results investigation demonstrates the effectiveness of the proposed SiP integrated half-bridge solution for an enhanced and reliable low voltage power supply.File | Dimensione | Formato | |
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https://hdl.handle.net/11583/2979982