Reliability Assessment of Nanoscale System on Chip Depending on Neturon Irradiation

The atmospheric neutron poses a serious hazard to nanoscale electronics reliability. Spallation neutron irradiations on a nanoscale system on chip (SoC) were conducted applying the China Spallation Neutron Source (CSNS), and the results were compared and analyzed using Monte Carlo simulation. The contribution from thermal neutron on the SoC single event effect (SEE) was analyzed. Analysis indicated the SoC atmospheric neutron SEE vulnerability can be reduced by 44.4% if the thermal neutron was absorbed. The influences of the B and Hf elements on the SEEs were evaluated, too. It can be concluded that 10 B interacting with thermal neutron is the reason for thermal neutron inducing SEE in the SoC. Although the Hf element has no contribution to the 28 nm SoC atmospheric neutron SEE cross section, it increases the total dose risk 5 times during atmospheric neutron irradiation.