This paper discusses on the potential application of the selective laser melting technology to the integration of microwave waveguide components in single monolithic parts. Three study cases working in Ku, K, or Ka bands are reported. For each study case, the correlation between the predicted and measured RF performance is significant. Benefits in terms of minimization of mass, envelope, interfaces and parts count are identified.

Integration of microwave components through selective laser melting / Addamo, G.; Peverini, O. A.; Manfredi, D.; Calignano, F.; Virone, G.; Lumia, M.. - (2019), pp. 1356-1358. (Intervento presentato al convegno 21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019 tenutosi a esp nel 2019) [10.1109/ICEAA.2019.8879387].

Integration of microwave components through selective laser melting

Addamo G.;Peverini O. A.;Manfredi D.;Calignano F.;Virone G.;Lumia M.
2019

Abstract

This paper discusses on the potential application of the selective laser melting technology to the integration of microwave waveguide components in single monolithic parts. Three study cases working in Ku, K, or Ka bands are reported. For each study case, the correlation between the predicted and measured RF performance is significant. Benefits in terms of minimization of mass, envelope, interfaces and parts count are identified.
2019
978-1-7281-0563-5
File in questo prodotto:
File Dimensione Formato  
Integration_of_Microwave_Components_through_Selective_Laser_Melting.pdf

accesso riservato

Tipologia: 2a Post-print versione editoriale / Version of Record
Licenza: Non Pubblico - Accesso privato/ristretto
Dimensione 546.22 kB
Formato Adobe PDF
546.22 kB Adobe PDF   Visualizza/Apri   Richiedi una copia
Pubblicazioni consigliate

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11583/2975092