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EnglishPower electronics converters used in applications requiring high reliability require an accurate thermal manage- ment for each component. Therefore, several methods for the estimation of the junction temperature of power devices are reported in the literature, having different features in terms of sensitivity, linearity and calibration process. Nevertheless, state of the art technologies in power modules packaging, such as the resin encapsulation technology, have shown that junction temperature estimation is still an open issue. In such modules, the lack of physical access to the die has led a growing interest in estimation methods based on thermo-sensitive electrical parame- ters. This paper proposes a non-invasive method for the junction temperature estimation of high current resin encapsulated IGBT power modules. The proposed solution is suitable for the thermal model validation of industrial converters thanks to the off-the- shelf components and the easiness of implementation.
Estimation of the Internal Junction Temperatures of Resin Encapsulated IGBT Power Modules / Gregorio, Matteo; Stella, Fausto; Bojoi, Radu; Pagani, Fabio. - (2020), pp. 3253-3260. ((Intervento presentato al convegno 2020 IEEE Energy Conversion Congress and Exposition (ECCE) tenutosi a Detroit (USA) nel 11-15 Oct. 2020 [10.1109/ECCE44975.2020.9235648].
| Titolo: | Estimation of the Internal Junction Temperatures of Resin Encapsulated IGBT Power Modules | |
| Autori: | ||
| Data di pubblicazione: | 2020 | |
| Abstract: | Power electronics converters used in applications requiring high reliability require an accurate... thermal manage- ment for each component. Therefore, several methods for the estimation of the junction temperature of power devices are reported in the literature, having different features in terms of sensitivity, linearity and calibration process. Nevertheless, state of the art technologies in power modules packaging, such as the resin encapsulation technology, have shown that junction temperature estimation is still an open issue. In such modules, the lack of physical access to the die has led a growing interest in estimation methods based on thermo-sensitive electrical parame- ters. This paper proposes a non-invasive method for the junction temperature estimation of high current resin encapsulated IGBT power modules. The proposed solution is suitable for the thermal model validation of industrial converters thanks to the off-the- shelf components and the easiness of implementation. | |
| ISBN: | 978-1-7281-5826-6 | |
| Appare nelle tipologie: | 4.1 Contributo in Atti di convegno |
File in questo prodotto:
| File | Descrizione | Tipologia | Licenza | |
|---|---|---|---|---|
| Estimation of junction temperature.pdf | 2. Post-print / Author's Accepted Manuscript | PUBBLICO - Tutti i diritti riservati | Visibile a tuttiVisualizza/Apri | |
| 09235648.pdf | 2a Post-print versione editoriale / Version of Record | Non Pubblico - Accesso privato/ristretto | Administrator Richiedi una copia |
http://hdl.handle.net/11583/2855065
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