In this study, the electrical resistivity of a glass-ceramic sealant is evaluated at 850 ◦C, for 2800 h under the applied voltage of 1.6 V. The glass-ceramic sealant is sandwiched between two Crofer22APU plates to produce Crofer22APU/Glass-ceramic/Crofer22APU samples. The Crofer22APU/glass-ceramic/Crofer22APU joints show electrical resistivity around 106-107 Ω cm, significantly high to ensure the insulation between two conductive interconnect plates. The detailed SEM-EDS post mortem analysis showed good thermo-mechanical compatibility of the glass-ceramic with the Crofer22APU substrates, thus excluding any detrimental interaction with the metallic interconnect under high applied voltage. XRD analysis of glass-ceramic confirmed the presence of crystalline phases with suitable CTEs, after electrical resistivity under harsh conditions.

Electrical characterization of glass-ceramic sealant-metallic interconnect joined samples under solid oxide electrolysis cell conditions; influence on the microstructure and composition at the different polarized interfaces / Javed, Hassan; Herbrig, Kai; Sabato, Antonio Gianfranco; Ferrero, Domenico; Santarelli, Massimo; Walter, Christian; Smeacetto, Federico. - In: CERAMICS INTERNATIONAL. - ISSN 0272-8842. - ELETTRONICO. - 47:6(2021), pp. 8184-8190. [10.1016/j.ceramint.2020.11.176]

Electrical characterization of glass-ceramic sealant-metallic interconnect joined samples under solid oxide electrolysis cell conditions; influence on the microstructure and composition at the different polarized interfaces

Javed, Hassan;Sabato, Antonio Gianfranco;Ferrero, Domenico;Santarelli, Massimo;Smeacetto, Federico
2021

Abstract

In this study, the electrical resistivity of a glass-ceramic sealant is evaluated at 850 ◦C, for 2800 h under the applied voltage of 1.6 V. The glass-ceramic sealant is sandwiched between two Crofer22APU plates to produce Crofer22APU/Glass-ceramic/Crofer22APU samples. The Crofer22APU/glass-ceramic/Crofer22APU joints show electrical resistivity around 106-107 Ω cm, significantly high to ensure the insulation between two conductive interconnect plates. The detailed SEM-EDS post mortem analysis showed good thermo-mechanical compatibility of the glass-ceramic with the Crofer22APU substrates, thus excluding any detrimental interaction with the metallic interconnect under high applied voltage. XRD analysis of glass-ceramic confirmed the presence of crystalline phases with suitable CTEs, after electrical resistivity under harsh conditions.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11583/2854932