High-side gate drivers to be used in EVs and HEVs should target high insulation voltage, as well as efficiency and monitoring capability. In traditional step-down converters, the entire control stage is referred to ground, thus either a pulse transformer or an isolated integrated gate driver is required. The paper proposes a buck converter having the entire control unit referred to the floating node. The design was carried out considering discrete components, which allows for low-cost and low-profile implementation. Simulations were conducted to validate the proposed converter, and to compare it with traditional high-side gate driver topologies. The overall efficiency results to be consistent with the other topologies, whereas the estimated occupied area and the cost, at PCB level, are both significantly lower.

A High Voltage Dc-Dc Converter for HEVs with a Novel Floating Control Stage / Raviola, Erica; Fiori, Franco. - STAMPA. - (2019). (Intervento presentato al convegno International Conference On Power Electronics, Control & Automation (ICPECA 2019) tenutosi a New Delhi (India) nel 16-17 November, 2019) [10.1109/ICPECA47973.2019.8975436].

A High Voltage Dc-Dc Converter for HEVs with a Novel Floating Control Stage

Raviola, Erica;Fiori, Franco
2019

Abstract

High-side gate drivers to be used in EVs and HEVs should target high insulation voltage, as well as efficiency and monitoring capability. In traditional step-down converters, the entire control stage is referred to ground, thus either a pulse transformer or an isolated integrated gate driver is required. The paper proposes a buck converter having the entire control unit referred to the floating node. The design was carried out considering discrete components, which allows for low-cost and low-profile implementation. Simulations were conducted to validate the proposed converter, and to compare it with traditional high-side gate driver topologies. The overall efficiency results to be consistent with the other topologies, whereas the estimated occupied area and the cost, at PCB level, are both significantly lower.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11583/2756632
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