This paper focuses on modeling of the interface between a rigid substrate and a thin elastic adherend subjected to mixed-mode loading in the peel test configuration. The problem is approached both analytically and numerically. The analytical model is based on linear-elastic fracture mechanics. In the numerical model, the interface is modeled with contact elements which take into account both debonding and contact using the node-to-segment contact strategy. Uncoupled cohesive interface laws are adopted in the normal and tangential directions. The models are able to predict the response of the bonded joint as a function of the main parameters. The main objective is to compute the debonding load and the effective bond length of the adherend as functions of the peel angle.

Modeling of mixed-mode debonding in the peel test applied to superficial reinforcements / De Lorenzis, L.; Zavarise, G.. - ELETTRONICO. - (2008), pp. ---. (Intervento presentato al convegno CICE 2008 tenutosi a Zurigo, Svizzera nel 22-24 luglio 2008).

Modeling of mixed-mode debonding in the peel test applied to superficial reinforcements

G. Zavarise
2008

Abstract

This paper focuses on modeling of the interface between a rigid substrate and a thin elastic adherend subjected to mixed-mode loading in the peel test configuration. The problem is approached both analytically and numerically. The analytical model is based on linear-elastic fracture mechanics. In the numerical model, the interface is modeled with contact elements which take into account both debonding and contact using the node-to-segment contact strategy. Uncoupled cohesive interface laws are adopted in the normal and tangential directions. The models are able to predict the response of the bonded joint as a function of the main parameters. The main objective is to compute the debonding load and the effective bond length of the adherend as functions of the peel angle.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11583/2700668