Interfacial stress analysis for thin plates bonded to curved substrates

This paper is focused on analytical and numerical modeling of the interface between a rigid substrate with simple curvature and a thin bonded plate. The interfacial behavior is modeled by independent cohesive laws in the normal and tangential directions. The analytical model makes use of appropriate simplifying assumptions. In the numerical model the interface is modeled by zero-thickness node-to-segment contact elements. In this paper the first results and comparisons between predictions of the two models are presented.