Archivio Istituzionale della RicercaA core-chip for X-band applications with on board serial-to-parallel conversion implementing a separate architecture topology is presented. The main RF performances are 10dB gain at minimum attenuation, 0-360° phase coverage, 0-31.5dB gain setting in less than 15 mm square, resulting in one of the smallest core chips realised in GaAs technology. The slight parasitic cross-effect between phase and gain setting is also described showing that the component can be used in beam forming networks for phased array applications without necessarily having to pre-calibrate at system level.
A Compact High Performance X–Band Core-Chip with on Board Serial-to-Parallel Conversion / Ciccognani, W.; Ferrari, M.; Ghione, Giovanni; Limiti, E.; Longhi, P. E.; Pirola, Marco; Quaglia, R.. - STAMPA. - (2010), pp. 902-905. (Intervento presentato al convegno 40th European Microwave Conference tenutosi a Parigi nel 28-30 Settembre 2010).
A Compact High Performance X–Band Core-Chip with on Board Serial-to-Parallel Conversion
GHIONE, GIOVANNI;PIROLA, Marco;
2010
Abstract
A core-chip for X-band applications with on board serial-to-parallel conversion implementing a separate architecture topology is presented. The main RF performances are 10dB gain at minimum attenuation, 0-360° phase coverage, 0-31.5dB gain setting in less than 15 mm square, resulting in one of the smallest core chips realised in GaAs technology. The slight parasitic cross-effect between phase and gain setting is also described showing that the component can be used in beam forming networks for phased array applications without necessarily having to pre-calibrate at system level.
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https://hdl.handle.net/11583/2658370
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