Archivio Istituzionale della RicercaThis paper deals with the susceptibility to radio frequency interference of smart power integrated circuits. A method to perform simulations aimed at evaluating the performance of subcircuits included in a more complex IC in the presence of EMI is presented. Referring to this, the behaviour of a current sensor included into a high-side power switch during DPI test is investigated. The results of simulation analyses and DPI tests are presented.
Smart power IC macromodeling for DPI analysis / Herrmann, H.; Horchler, W.; Schwarz, S.; Schroter, P.; Klotz, F.; BRIGNONE AIMONETTO, Marco; Fiori, Franco. - STAMPA. - (2015), pp. 244-247. (Intervento presentato al convegno 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2015 tenutosi a Edinburgh (UK) nel November, 2015) [10.1109/EMCCompo.2015.7358365].
Smart power IC macromodeling for DPI analysis
BRIGNONE AIMONETTO, MARCO;FIORI, Franco
2015
Abstract
This paper deals with the susceptibility to radio frequency interference of smart power integrated circuits. A method to perform simulations aimed at evaluating the performance of subcircuits included in a more complex IC in the presence of EMI is presented. Referring to this, the behaviour of a current sensor included into a high-side power switch during DPI test is investigated. The results of simulation analyses and DPI tests are presented.
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https://hdl.handle.net/11583/2626941
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