Archivio Istituzionale della RicercaThe paper deals with the propagation of EMI in Smart Power SoCs through high frequency parasitic paths, i.e. silicon substrate, and it focuses on the interaction between on-chip parasitic capacitors and package parasitic elements, that negatively affects IC electromagnetic emission. The paper highlights such unwanted parasitic effects through computer simulations and experimental test results. Finally, a new grounding scheme to improve the EMC performance of such integrated circuits is presented.
Impact of Package Parasitics on the EMC Performance of SmartPower SoCs / Merlin, M; Fiori, Franco. - 1:(2009), pp. 1-6. (Intervento presentato al convegno EMPC 2009 tenutosi a Rimini nel june 15-18, 2009).
Impact of Package Parasitics on the EMC Performance of SmartPower SoCs
FIORI, Franco
2009
Abstract
The paper deals with the propagation of EMI in Smart Power SoCs through high frequency parasitic paths, i.e. silicon substrate, and it focuses on the interaction between on-chip parasitic capacitors and package parasitic elements, that negatively affects IC electromagnetic emission. The paper highlights such unwanted parasitic effects through computer simulations and experimental test results. Finally, a new grounding scheme to improve the EMC performance of such integrated circuits is presented.
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https://hdl.handle.net/11583/2262317
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