Ultra-precision grinding process and compensation of cylindrical structure array mold

WC-Co carbide cylindrical array molds are essential for the high-efficiency manufacturing of high-precision optical lenses. However, due to the extreme hardness, brittleness, and complex dynamic mechanical response of the material, achieving high-efficiency and high-precision machining while suppressing surface damage remains a critical challenge. By utilizing a calibrated JH-2 constitutive model, this work analyzes the material removal mechanisms of WC-Co to disclose dynamic failure behaviors and define the critical depth threshold for ductile-regime removal. Subsequently, a hybrid grinding strategy is developed by integrating rough grinding via a profile diamond wheel with fine compensation using an ultra-thin diamond wheel, complemented by a constant material removal rate global path planning method. Experimental results demonstrate that the proposed approach achieves a form accuracy PV of 2.43 μm and a surface roughness Sa of 17.025 nm for the array mold, with excellent morphological uniformity. These results indicate that the proposed strategy is beneficial not only for deterministic form generation, but also for suppressing brittle damage and preserving the surface integrity required for functional structured molds.