The calibration of the effects of process variations and device mismatch in Ultra Low Voltage (ULV) Digital-Based Operational Transconductance Amplifiers (DB-OTAs) is addressed in this paper. For this purpose, two dynamic calibration techniques, intended to dynamically vary the effective strength of critical gates by different modulation strategies, i.e., Digital Pulse Width Modulation (DPWM) and Dyadic Digital Pulse Modulation (DDPM), are explored and compared to classic static calibration. The effectiveness of the calibration approaches as a mean to recover acceptable performance in non-functional samples is verified by Monte-Carlo (MC) post-layout simulations performed on a 300 mV power supply, nW-power DB-OTA in 180 nm CMOS. Based on the same MC post-layout simulations, the impact of each calibration strategy on silicon area, power consumption, and OTA performance is discussed.
Dynamic and Static Calibration of Ultra-Low-Voltage, Digital-Based Operational Transconductance Amplifiers / Pedro, Toledo; Crovetti, PAOLO STEFANO; Klimach, Hamilton; Bampi, Sergio. - In: ELECTRONICS. - ISSN 2079-9292. - ELETTRONICO. - 9:6(2020), pp. 1-15. [10.3390/electronics9060983]
Dynamic and Static Calibration of Ultra-Low-Voltage, Digital-Based Operational Transconductance Amplifiers
Pedro Toledo;Paolo Crovetti;
2020
Abstract
The calibration of the effects of process variations and device mismatch in Ultra Low Voltage (ULV) Digital-Based Operational Transconductance Amplifiers (DB-OTAs) is addressed in this paper. For this purpose, two dynamic calibration techniques, intended to dynamically vary the effective strength of critical gates by different modulation strategies, i.e., Digital Pulse Width Modulation (DPWM) and Dyadic Digital Pulse Modulation (DDPM), are explored and compared to classic static calibration. The effectiveness of the calibration approaches as a mean to recover acceptable performance in non-functional samples is verified by Monte-Carlo (MC) post-layout simulations performed on a 300 mV power supply, nW-power DB-OTA in 180 nm CMOS. Based on the same MC post-layout simulations, the impact of each calibration strategy on silicon area, power consumption, and OTA performance is discussed.File | Dimensione | Formato | |
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https://hdl.handle.net/11583/2835572