Capacitive coupled RFID tag using a new dielectric droplet encapsulation approach

Radio frequency identification (RFID) is a well-known and fast-growing technology used to identify people, animals and products. RFID tags are used to replace bar codes in a wide range of applications, to mention just a few, retail, transportation, logistics and healthcare. The two main driving aspects for most of research and development projects concerning RFID tags are the reduction of assembly costs and the downsizing of microchips. In that respect and considering an Industry 4.0 scenario, the study of a new assembly approach for passive and high frequency RFID tags has been proposed and studied in this thesis. In this new approach, which is based on the inkjet printing technology, a specifically designed radio frequency integrated circuit (RFIC) will be delivered, inside a liquid dielectric droplet, onto the antenna and no longer placed and oriented precisely as it happens nowadays with pick-and-place and flip chip machines. After a landing phase, the liquid droplet (with the encapsulated chip) will self-aligns with respect to the contact thanks to capillary forces driven by specifically designed wetting conditions on the substrate of the antenna. Finally, with few additional steps, the complete RFID tag is created. This research project brings to light a considerable simplification and a very high potential of parallelization, compatible with large volume manufacturing methods, in comparison to nowadays existing technologies. This may substantially drive down the fabrication costs. An in-depth analysis of electrical performances have been carefully undertaken and compliance with the ISO/IEC 144443 standard has been verified. Mathematical models have been developed showing fundamental limits for the maximum tag reading range and power requirements of the RFID reader.