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EnglishThis paper is focused on the analytical modeling of the interface between a rigid substrate with constant curvature and a thin bonded plate. In a previous investigation, an analytical cohesive zone (CZ) model capable of predicting the interfacial behavior prior to the onset of debonding has been proposed by the authors. As a follow-up, this paper presents a new analytical model, which is able to predict both the load at onset of debonding and the sub- sequent evolution of the debonding process. The study clarifies the essential differences in behavior between joints with flat and curved substrates during debonding. The new ana- lytical model is based on linear-elastic fracture mechanics (LEFM) and is developed under two distinct assumptions: a mode-independent fracture energy, and a fracture energy dependent on the mode mixity, according to a simple mixed-mode fracture criterion. The model is applied to the determination of the load at onset of debonding, and to the pre- diction of the load–displacement behavior during the entire debonding process. The rela- tionship between the predictions of the CZ and LEFM models regarding the load at initiation of debonding is also established.
Debonding analysis of thin plates from curved substrates / Zavarise, Giorgio; De Lorenzis, L.. - In: ENGINEERING FRACTURE MECHANICS. - ISSN 0013-7944. - STAMPA. - 77(2010), pp. 3310-3328. [10.1016/j.engfracmech.2010.08.013]
| Titolo: | Debonding analysis of thin plates from curved substrates | |
| Autori: | ||
| Data di pubblicazione: | 2010 | |
| Rivista: | ||
| Digital Object Identifier (DOI): | http://dx.doi.org/10.1016/j.engfracmech.2010.08.013 | |
| Appare nelle tipologie: | 1.1 Articolo in rivista |
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http://hdl.handle.net/11583/2700581
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