In the present work, micro-protruded patterns on flush mounted heat sinks for convective heat transfer enhancement are investigated and a novel methodology for thermal optimization is proposed. Patterned heat sinks are experimentally characterized in fully turbulent regime, and the role played by geometrical parameters and fluid dynamic scales are discussed. A methodology specifically suited for micro-protruded patterns optimization is designed, leading to 73 % enhancement in thermal performance respect to commercially available heat sinks, at fixed costs. This work is expected to introduce a new methodological approach for a more systematic and efficient development of solutions for electronics cooling.

Convective heat transfer enhancement by diamond shaped micro-protruded patterns for heat sinks: Thermal fluid dynamic investigation and novel optimization methodology / Ventola, Luigi; Dialameh, Masoud; Fasano, Matteo; Chiavazzo, Eliodoro; Asinari, Pietro. - In: APPLIED THERMAL ENGINEERING. - ISSN 1359-4311. - STAMPA. - 93:(2016), pp. 1254-1263. [10.1016/j.applthermaleng.2015.10.065]

Convective heat transfer enhancement by diamond shaped micro-protruded patterns for heat sinks: Thermal fluid dynamic investigation and novel optimization methodology

VENTOLA, LUIGI;DIALAMEH, MASOUD;FASANO, MATTEO;CHIAVAZZO, ELIODORO;ASINARI, PIETRO
2016

Abstract

In the present work, micro-protruded patterns on flush mounted heat sinks for convective heat transfer enhancement are investigated and a novel methodology for thermal optimization is proposed. Patterned heat sinks are experimentally characterized in fully turbulent regime, and the role played by geometrical parameters and fluid dynamic scales are discussed. A methodology specifically suited for micro-protruded patterns optimization is designed, leading to 73 % enhancement in thermal performance respect to commercially available heat sinks, at fixed costs. This work is expected to introduce a new methodological approach for a more systematic and efficient development of solutions for electronics cooling.
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11583/2624291
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