Temperature has traditionally been a key parameter to take into account during the many stages of IC design flows, and in particular, during the sign-off phases of critical circuit components like the Clock Distribution Networks (CDNs). While for old technologies this task was accomplished by means of worst case corner-based static analysis, the advent of nanometric CMOS technologies made this approach intrinsically inadequate. This paper provides a detailed analysis of clock skew variations induced by non-uniform thermal profiles on tree-like CDNs. Using a dedicated simulation framework, we characterized the complex thermal effects that metal interconnects and buffers under inverted temperature dependence (ITD) may induce on the clock tree. Experiments conducted on a synthetic, thermal-programmable benchmark underline the presence of unexpected behaviors that standard tools are not able to catch.
|Titolo:||Modeling and Characterization of Thermally-Induced Skew on Clock Distribution Networks of Nanometric ICs|
|Data di pubblicazione:||2013|
|Digital Object Identifier (DOI):||10.1016/j.mejo.2012.07.007|
|Appare nelle tipologie:||1.1 Articolo in rivista|
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