Joining is a key and fundamental aspect of vehicle design and manufacturing process.The development of efficient, simple, inexpensive and reversible adhesive bonding technologies offers low cost, improved life cycle and recycling solutions for a vehicle. This innovative technology is based on magneto sensitive nanoparticles dispersed into the adhesive. Different typologies of susceptors, embedded in thermoplastic hot-melt adhesives, have been tested to investigate the thermal behavior of these innovative materials when exposed to electromagnetic fields. These innovative technologies are intended to optimize the bonding process offering new opportunities connected with costruction, improved resistance to applied loads, easy and rapid dismantling and smart recycling. Experimental procedures to optimize the electromagnetic process have been performed. Results about both shear strength and sliding temperature of the modified adhesives are presented.

Adhesivejoiningtechnologiesactivatedbyelectro-magnetic external trims / Elena, Verna; Cannavaro, Irene; Valentina, Brunella; Koricho, ERMIAS GEBREKIDAN; Belingardi, Giovanni; Davide, Roncato; Brunetto, Martorana; Vito, Lambertini; Vasilica Alina, Neamtu; Romeo, Ciobanu. - In: INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES. - ISSN 1879-0127. - STAMPA. - (2013), pp. 21-25. [10.1016/j.ijadhadh.2013.05.008]

Adhesivejoiningtechnologiesactivatedbyelectro-magnetic external trims

CANNAVARO, IRENE;KORICHO, ERMIAS GEBREKIDAN;BELINGARDI, Giovanni;
2013

Abstract

Joining is a key and fundamental aspect of vehicle design and manufacturing process.The development of efficient, simple, inexpensive and reversible adhesive bonding technologies offers low cost, improved life cycle and recycling solutions for a vehicle. This innovative technology is based on magneto sensitive nanoparticles dispersed into the adhesive. Different typologies of susceptors, embedded in thermoplastic hot-melt adhesives, have been tested to investigate the thermal behavior of these innovative materials when exposed to electromagnetic fields. These innovative technologies are intended to optimize the bonding process offering new opportunities connected with costruction, improved resistance to applied loads, easy and rapid dismantling and smart recycling. Experimental procedures to optimize the electromagnetic process have been performed. Results about both shear strength and sliding temperature of the modified adhesives are presented.
File in questo prodotto:
Non ci sono file associati a questo prodotto.
Pubblicazioni consigliate

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11583/2508543
 Attenzione

Attenzione! I dati visualizzati non sono stati sottoposti a validazione da parte dell'ateneo