A phenomenological approach is proposed to identify some effects occurring within the structure of the microswitch conceived for radio frequency application. This microsystem is operated via a nonlinear electromechanical action imposed by the applied voltage. Unfortunately, it can be affected by residual stress, due to the microfabrication process, therefore axial and flexural behaviors are strongly coupled. This coupling increases the actuation voltage required to achieve the so-called ‘‘pull-in’’ condition. Moreover, temperature may strongly affect strain and stress distributions, respectively. Environmental temperature, internal dissipation of material, thermo-elastic and Joule effects play different roles on the microswitch flexural isplacement. Sometimes buckling phenomenon evenly occurs. Literature show that all those issues make difficult an effective computation of ‘‘pull-in’’ and ‘‘pull-out’’ voltages for evenly distinguishing the origin of some failures detected in operation. Analysis, numerical methods and experiments are applied to an industrial test case to investigate step by step the RF-microswitch operation. Multiple electro-hermomechanical coupling is first modeled to have a preliminary and comprehensive description of the microswitch behavior and of its reliability. ‘‘Pull-in’’ and ‘‘pull-out’’ tests are then performed to validate the proposed models and to find suitable criteria to design the RF-MEMS.

Role of the electro-thermo-mechanical multiple coupling on the operation of RF microswitch / Brusa, Eugenio; Munteanu, M. G. h.. - In: MICROSYSTEM TECHNOLOGIES. - ISSN 0946-7076. - STAMPA. - 18:(2012), pp. 983-995. [10.1007/s00542-012-1426-z]

Role of the electro-thermo-mechanical multiple coupling on the operation of RF microswitch

BRUSA, Eugenio;
2012

Abstract

A phenomenological approach is proposed to identify some effects occurring within the structure of the microswitch conceived for radio frequency application. This microsystem is operated via a nonlinear electromechanical action imposed by the applied voltage. Unfortunately, it can be affected by residual stress, due to the microfabrication process, therefore axial and flexural behaviors are strongly coupled. This coupling increases the actuation voltage required to achieve the so-called ‘‘pull-in’’ condition. Moreover, temperature may strongly affect strain and stress distributions, respectively. Environmental temperature, internal dissipation of material, thermo-elastic and Joule effects play different roles on the microswitch flexural isplacement. Sometimes buckling phenomenon evenly occurs. Literature show that all those issues make difficult an effective computation of ‘‘pull-in’’ and ‘‘pull-out’’ voltages for evenly distinguishing the origin of some failures detected in operation. Analysis, numerical methods and experiments are applied to an industrial test case to investigate step by step the RF-microswitch operation. Multiple electro-hermomechanical coupling is first modeled to have a preliminary and comprehensive description of the microswitch behavior and of its reliability. ‘‘Pull-in’’ and ‘‘pull-out’’ tests are then performed to validate the proposed models and to find suitable criteria to design the RF-MEMS.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11583/2475181
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