Archivio Istituzionale della RicercaMOGLIA, ALESSANDRO
MOGLIA, ALESSANDRO
Dipartimento di Elettronica e Telecomunicazioni
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Enabling Full-System Transient Power Integrity Verification via Model Order Reduction and Waveform Relaxation
2025 Carlucci, Antonio; Moglia, Alessandro; Grivet-Talocia, Stefano; Kulasekaran, Siddharth; Radhakrishnan, Kaladhar
Fast Transient Simulation of System-Level Power Delivery Networks via Parallel Waveform Relaxation
2025 Moglia, Alessandro; Carlucci, Antonio; Grivet-Talocia, Stefano; Kulasekaran, Siddharth; Radhakrishnan, Kaladhar
A Two-Level Waveform Relaxation Approach for System-Level Power Delivery Verification
2023 Moglia, Alessandro; Carlucci, Antonio; Grivet-Talocia, Stefano; Mongrain, Scott; Kulasekaran, Sid; Radhakrishnan, Kaladhar
| Citazione | Data di pubblicazione | Autori | File |
|---|---|---|---|
| Enabling Full-System Transient Power Integrity Verification via Model Order Reduction and Waveform Relaxation / Carlucci, Antonio; Moglia, Alessandro; Grivet-Talocia, Stefano; Kulasekaran, Siddharth; Radhakrishnan, Kaladhar. - In: IEEE ELECTROMAGNETIC COMPATIBILITY MAGAZINE. - ISSN 2162-2264. - 14:1(2025), pp. 70-82. [10.1109/memc.2025.11051184] | 1-gen-2025 | Carlucci, AntonioMoglia, AlessandroGrivet-Talocia, Stefano + | jnl-2025-emcmagazine-apis-IEEE.pdf; jnl-2025-emcmagazine-apis-final.pdf |
| Fast Transient Simulation of System-Level Power Delivery Networks via Parallel Waveform Relaxation / Moglia, Alessandro; Carlucci, Antonio; Grivet-Talocia, Stefano; Kulasekaran, Siddharth; Radhakrishnan, Kaladhar. - In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY. - ISSN 2156-3950. - STAMPA. - 15:1(2025), pp. 39-53. [10.1109/tcpmt.2024.3410146] | 1-gen-2025 | Moglia, AlessandroCarlucci, AntonioGrivet-Talocia, Stefano + | jnl-2025-tcpmt-apis-wr-IEEE.pdf |
| A Two-Level Waveform Relaxation Approach for System-Level Power Delivery Verification / Moglia, Alessandro; Carlucci, Antonio; Grivet-Talocia, Stefano; Mongrain, Scott; Kulasekaran, Sid; Radhakrishnan, Kaladhar. - ELETTRONICO. - (2023), pp. 1-3. (Intervento presentato al convegno 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) tenutosi a Rose Hill (Mauritius) nel 12-14 December 2023) [10.1109/edaps58880.2023.10468326]. | 1-gen-2023 | Moglia, AlessandroCarlucci, AntonioGrivet-Talocia, Stefano + | cnf-2023-edaps-WR-IEEE.pdf; cnf-2023-edaps-WR.pdf |