Modeling and Simulation for Signal and Power Integrity in Mobile Platforms

This tutorial will cover technological, architectural, modeling and simulation challenges for the Signal and Power Integrity of high-end mobile platforms. On one hand, the latest packaging technologies for mobile applications will be discussed, emphasizing their pros and cons in view of current and expected future system requirements. On the other hand, the architectural challenges will be translated into modeling and simulation challenges, that engineers have to face in their daily work for ensuring system-level signal and power quality. Fast simulation approaches based on reduced-order behavioral models for both interconnects and devices will be discussed in detail. Finally, case studies from real mobile applications will be illustrated.