Archivio Istituzionale della RicercaDespite the proliferation of high fidelity finite-element (FE) models, lower fidelity models remain commonly used in adhesively bonded joint design. These design models can save both computational and user time due to their simplicity and ease of use. This study presents a detailed assessment of local stress fields predicted by five design models: A4EI, HyperSizer, Joint Element Designer, Carrera Unified Formulation, and a Continuum Solid Shell FE model. All models were compared with a high fidelity, dense mesh FE model. Six double lap joint cases with different combinations of features like different adhereds, a core, and tapers were compared.
A critical assessment of design tools for stress analysis of adhesively bonded double lap joints / Stapleton, S. E.; Stier, B.; Jones, S.; Bergan, A.; Kaleel, I.; Petrolo, M.; Carrera, E.; Bednarcyk, B. A.. - In: MECHANICS OF ADVANCED MATERIALS AND STRUCTURES. - ISSN 1537-6494. - STAMPA. - 28:8(2021), pp. 791-811. [10.1080/15376494.2019.1600768]
A critical assessment of design tools for stress analysis of adhesively bonded double lap joints
I. Kaleel;M. Petrolo;E. Carrera;
2021
Abstract
Despite the proliferation of high fidelity finite-element (FE) models, lower fidelity models remain commonly used in adhesively bonded joint design. These design models can save both computational and user time due to their simplicity and ease of use. This study presents a detailed assessment of local stress fields predicted by five design models: A4EI, HyperSizer, Joint Element Designer, Carrera Unified Formulation, and a Continuum Solid Shell FE model. All models were compared with a high fidelity, dense mesh FE model. Six double lap joint cases with different combinations of features like different adhereds, a core, and tapers were compared.
| File | Dimensione | Formato | |
|---|---|---|---|
|
SSJBKPCB_MAMS_2021.pdf
accesso aperto
Descrizione: Pre-print
Tipologia:
1. Preprint / submitted version [pre- review]
Licenza:
Creative commons
Dimensione
3.7 MB
Formato
Adobe PDF
|
3.7 MB | Adobe PDF | Visualizza/Apri |
|
SSJBKPCB_MAMS_2021.pdf
Open Access dal 20/06/2020
Descrizione: Post-print
Tipologia:
2. Post-print / Author's Accepted Manuscript
Licenza:
Creative commons
Dimensione
3.7 MB
Formato
Adobe PDF
|
3.7 MB | Adobe PDF | Visualizza/Apri |
|
SSJBKPCB_MAMS_2021.pdf
non disponibili
Descrizione: Online version
Tipologia:
2a Post-print versione editoriale / Version of Record
Licenza:
Non Pubblico - Accesso privato/ristretto
Dimensione
6.66 MB
Formato
Adobe PDF
|
6.66 MB | Adobe PDF | Visualizza/Apri Richiedi una copia |
Pubblicazioni consigliate
I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
https://hdl.handle.net/11583/2874433